Cadence Level-5 ChipStack Cuts Semiconductor Verification Cycles From Five Weeks to Under a Day

Chip verification bottlenecks may soon become a thing of the past following Cadence’s COMPUTEX 2026 launch of its Level-5 ChipStack™ AI Super Agent. Developed in deep collaboration with NVIDIA, the autonomous engineering framework integrates directly with Cadence’s signature Xcelium™ Logic Simulation and Jasper® Formal Verification engines to supercharge debugging cycles. In massive internal tests, thousands of engineers deploying these autonomous agents achieved a staggering 40X acceleration in RTL validation. By compressing a traditional, grueling five-week verification loop down to less than 24 hours, the platform resolves one of the costliest and most labor-intensive bottlenecks in modern semiconductor development.

“We see our customers using AI to let their expert engineers take on more ambitious silicon designs with greater speed and confidence,” said Paul Cunningham, senior vice president and general manager of the System Verification Group at Cadence. “With the ChipStack AI Super Agent, we’re taking the next step—moving from AI that assists engineers to autonomous virtual engineers that can implement real design and verification work, grounded in our signoff-accurate engines and running in secure, governed environments so teams can innovate faster with confidence.”

From AI Assistance to Autonomous Engineering

The ChipStack AI Super Agent now operates at Level-5 autonomy, independently executing complex chip design and verification workflows while allowing engineers to inspect, guide and collaborate as needed. Native integration with collaboration environments and compatibility with tools like Codex or Claude Code, provides transparency into autonomous activity, helping teams stay connected to the system’s progress and decisions.

Rather than relying on step-by-step prompts, the ChipStack AI Super Agent evaluates intermediate results, determines next actions and iterates toward closure across tasks such as specification understanding, RTL generation, verification planning, formal analysis, simulation, debug and design convergence. This shifts engineers from executing individual tasks to supervising outcomes and guiding intent, as autonomous verification workflows shrink validation cycles that traditionally took weeks down to less than a day in leading-edge deployments.

Grounded in Engineering Truth, Secured for Production

A key Cadence differentiator is that autonomous agent behavior is tightly coupled with the company’s core physics-based design and verification engines. This keeps AI-directed actions grounded in proven computational models and signoff-accurate results, creating the trust needed for high-stakes engineering programs.

To support production deployment, the ChipStack AI Super Agent is run within the NVIDIA OpenShell runtime, a sandboxed environment for autonomous agents that enforces governance and helps protect sensitive IP through policy controls, isolation and managed access to tools, infrastructure and design data. Together, Cadence’s physics-based engines and OpenShell’s security architecture provide a practical path from supervised pilots to production-grade autonomous flows.

“As semiconductor designs grow more complex, engineering teams need AI agents that can accelerate verification without compromising security, control or trust,” said Timothy Costa, vice president and general manager of computational engineering at NVIDIA. “By securing Cadence's ChipStack AI Super Agent with NVIDIA OpenShell and powering it with Nemotron models, Cadence is bringing governed autonomy to chip design workflows — giving customers a faster, more secure path to develop and validate advanced semiconductors.”

Leading the Next Era of Agentic AI

This announcement reflects the speed of Cadence innovation in agentic AI, powered by NVIDIA. Following the acquisition of ChipStack in November 2025, Cadence launched its first product in February 2026 and expanded into a portfolio of AI super agents at CadenceLIVE in April, introducing ViraStack AI Super Agent for custom and analog design, InnoStack AI Super Agent for digital implementation and signoff, and Cadence AgentStack as the orchestration framework for coordinating agentic workflows across the design stack. Cadence is now extending those capabilities to full autonomy.

Availability

The Level-5 autonomous capabilities of the ChipStack AI Super Agent and the AgentStack orchestration framework are expected to be available to early-access customers in the second half of 2026.

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COMPUTEX 2026 Concludes in Taipei, Drawing Over 111,000 Global Buyers to Shape the New AI Ecosystem

COMPUTEX 2026, one of the world's premier exhibitions for AIoT and startup innovation, concluded its annual run today after successfully anchoring Taipei as the epicenter of international technology trade. Centered around the forward-looking theme "AI Together," the four-day event became a massive hub for cross-border industry collaboration and commercial matchmaking. The trade show drew a massive crowd of 111,312 buyers and visitors representing 152 countries and regions—with heavy participation from key tech markets including Japan, the United States, South Korea, India, and Malaysia—solidifying its position as the ultimate platform for accelerating global AI deployment.

Physical AI Emerges as the Next Frontier of Industrial Innovation

As AI rapidly evolves beyond digital environments into real-world deployment, industries are accelerating investments in physical AI applications. According to a report by Strategy&, part of PwC, Physical AI is expected to generate approximately €430 billion in global market value by 2030 and reach large-scale commercial adoption within the next three to five years across sectors such as manufacturing, logistics, healthcare, and aerospace.

Reflecting this trend, COMPUTEX 2026 returned to TWTC Hall 1 and introduced the inaugural AI Robotics Zone, bringing together ecosystem partners across the supply chain to showcase robotics, Embodied AI technologies, and integrated solutions. The exhibition highlighted the critical technologies enabling the transition from research and development to real-world deployment.

To further expand the exhibition’s technology landscape, COMPUTEX also launched the E-paper Pavilion and the TechXperience, featuring more than 180 exhibitors and adding new dimensions to this year’s showcase.

Global Technology Leaders Outline the Future of AI

COMPUTEX Keynotes once again gathered influential leaders from across the global technology industry to discuss the future of AI computing, edge computing, next-generation platforms, and intelligent mobility.

The keynote series opened with Cristiano R. Amon, President and CEO of Qualcomm, followed by Matt Murphy, Chairman and CEO of Marvell, Lip-Bu Tan, CEO of Intel, and Rafael Sotomayor, President and CEO of NXP. The keynote sessions attracted 6,000 attendees, reflecting the industry’s strong interest in the future of AI innovation.

The COMPUTEX Forum brought together 28 industry leaders and technology experts from leading global enterprises to discuss six major themes, including AI computing, robotics, and data governance. The forum drew over 13,200 visits, reflecting the rising industry focus on AI and its growing impact across sectors. Discussions covered topics ranging from infrastructure and computing platforms to enterprise adoption and governance strategies, helping businesses navigate opportunities for scaling AI deployment and accelerating commercialization.

InnoVEX Reaches a New Milestone with Global Startup Participation

As one of Asia’s leading startup platforms, InnoVEX 2026 reached a new milestone, featuring more than 500 startups—an increase of over 11% from last year. Taiwan, Japan, and South Korea ranked as the top three participating countries and regions, while startups from 23 countries took part in this year’s exhibition.

For the first time, InnoVEX partnered with Plug and Play Taiwan, one of the world’s largest open innovation platforms and accelerators, and Japanese startup exhibition organizer Everidge, further strengthening international innovation networks and market expansion opportunities.

In addition, nine national pavilions—including France, Japan, South Korea, Thailand, Australia, Israel, Canada, Italy, and the Czech Republic—showcased cutting-edge innovations in AI, robotics, and intelligent mobility, creating a truly global platform for technology exchange.

The InnoVEX Forum featured speakers from France, Japan, the United States, and other countries under the theme “AI in Action,” exploring topics such as AI infrastructure roadmaps, industrial implementation strategies, open-source business models, and AI-driven workflow and data transformation.

Meanwhile, the InnoVEX Pitch Contest continued to integrate three critical resources—capital, computing power, and industry validation—into a comprehensive innovation support platform that connects startups with global investors and industry partners. The competition’s grand prize was awarded to RLWRLD.

Sustainability and Lifestyle Experiences Redefine the Exhibition Journey

COMPUTEX 2026 continued to strengthen its commitment to sustainability by embracing the principles of Reduce, Reuse, and Recycle (3R) and collaborating with exhibitors to create a lower-carbon, lower-pollution, and more energy-efficient exhibition environment.

This year’s Sustainable Design Award introduced two new categories—Flagship Scale and Rising Innovator—to encourage broader participation in sustainable exhibition practices. The awards were presented to ASUS and Transcend Information, respectively.

Beyond technology, COMPUTEX continued to bridge innovation with lifestyle experiences. In partnership with China Airlines and GQ, the exhibition launched the COMPUTEX Service Lounge, blending business hospitality, lifestyle experiences, and Taiwanese cultural elements. Interactive relaxation spaces created by Red Bull and Sleepy Tofu further enhanced the visitor experience.

In addition, COMPUTEX collaborated with renowned generative artist Aluan Wang to create a large-scale interactive art installation at the entrance of Nangang Exhibition Center Hall 1. Visitors were invited to generate unique visual patterns displayed on six-meter-high LED columns, creating an immersive fusion of technology, creativity, and public participation.

COMPUTEX will take place from June 1–4, 2027, across Nangang Exhibition Halls 1 and 2 and TWTC Hall 1. Continuing the spirit of “AI Together,” the exhibition will further connect global partners to drive AI innovation and industrial advancement toward a smarter future.

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ASUS ProArt PZ14 Now Available in Malaysia to Empower Next-Gen Creative Workflows

ASUS Malaysia announced the availability of the all-new ProArt PZ14, the most powerful ASUS creator tablet yet. Crafted from CNC-machined aluminum in a striking Nano Black finish with smudge-resistant technology for a cleaner and more premium look, its ultralight 0.79 kg, 9mm-thin unibody chassis offers both portability and military-grade durability. ProArt PZ14 is designed for creators who require mobility, AI acceleration, and precision visual tools in a lightweight and tough form factor.

Powered by the 18-core Snapdragon® X2 Elite processor with an 80 TOPS NPU, along with a Qualcomm® Adreno™ GPU for smooth creativity, ProArt PZ14 combines all-day battery life and high performance with a slim and lightweight chassis engineered for work in studios, field locations, and hybrid production environments.

Visuals are enhanced by the latest ASUS Lumina Pro OLED display with a special anti-reflective coating that cuts reflections by 65% for a more comfortable viewing experience even in challenging lighting environments. 144Hz, up to 1000-nit HDR touchscreen, which supports the included ASUS Pen 3.0 stylus for precise and ergonomic input alongside the detachable Bluetooth® keyboard. The latest Copilot features and ASUS-exclusive AI-powered StoryCube, MuseTree and ProArt Creator Hub creator apps ensure smooth creative workflows.

Featuring extensive I/O ports, including two 40Gbps USB4® ports for fast charging and external displays, and an SD Express 7.0 card reader for super-quick transfers, ProArt PZ14 also has ultrafast WiFi 7 for seamless connectivity anywhere. Tested to exceed the stringent MIL-STD 810H US durability standard, ProArt PZ14 is the ideal choice for professional-grade production in both studio and field environments.

ProArt PZ14 features the 18-core Snapdragon X2 Elite processor with an up to 80 TOPS NPU, enabling creative workloads powered by on-device AI. The architecture supports concurrent AI-enhanced tasks with reduced latency, allowing complex editing, enhancement, and multitasking operations to run efficiently without relying on external compute resources.

The processor’s integrated Qualcomm Hexagon™ NPU is designed for continuous intelligent processing, delivering responsiveness across creative applications such as image enhancement, audio clean-up, generative assistance, and accelerated workflow automation. This foundation supports an all-day production cycle through advanced power management and efficient thermal design. With its Qualcomm Adreno GPU, ProArt PZ14 delivers smooth graphics, vibrant visuals, and efficient performance for mobile design, video editing, and creative applications.

Featuring up to 32GB LPDDR5X memory, ProArt PZ14 enables seamless workflows across multiple creator apps. A 75Wh battery supports extended mobile use, and 0dB cooling technology allows silent operation during low-intensity workloads while maintaining low noise even at higher loads. Collectively, these components position ProArt PZ14 as a detachable device capable of desktop-class creative performance in portable settings.

For visual excellence, ProArt PZ14 integrates a 14-inch ASUS Lumina Pro OLED touchscreen that offers a 100% DCI-P3 gamut, 10.7-billion-color output, and Delta E 1 color accuracy. It's Pantone® Validated to ensure fidelity for color-critical work. This ensures true-to-life color reproduction, so your work stays consistent from concept to final output across screens, prints, and platforms.

The 243 PPI panel has up to 1000 nits HDR peak brightness, a 1,000,000:1 contrast ratio, and certifications including VESA DisplayHDR™ True Black 1000 and Dolby Vision®. The 144Hz variable refresh rate (VRR) and 0.2 ms response time support motion-intensive workflows such as animation, video editing, and interactive content review. This delivers consistently smooth, clear visuals in any lighting, letting creators review motion-heavy content with confidence from outdoor work sessions to studio environments.

To enhance visual comfort, the display employs an anti-reflection coating that reduces glare by 65% and increases ambient contrast by 4.5X. Additional eye-care protections include adaptive brightness and color adjustments, and a reduction of harmful blue light by approximately 70%, supported by TÜV Rheinland certification. This improves visibility in any environment while reducing eye strain, allowing creators to stay focused and comfortable through extended creative sessions. This display environment provides a platform suited to professional color work and motion content, while maintaining clarity and visibility across varied lighting conditions.

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Acer Brings Smart Connected E-mobility to COMPUTEX 2026

Acer is presenting at COMPUTEX 2026 a comprehensive range of e-bikes and e-scooters paired with a unified software experience, advancing its smart connected e-mobility strategy. Building on its ICT expertise, Acer continues to extend its smart e-mobility portfolio beyond hardware, enabling more intuitive, data-driven, and connected riding experiences for everyday urban use.

Versatile Electric Mobility for Everyday Urban Riding

Acer’s latest electric mobility lineup is designed to address diverse urban commuting needs, featuring both the Acer Nitro eCity Plus e-bike and the Acer ES Series 3 Select e-scooter.

The Acer Nitro eCity Plus e-bike (ANCI-R8620O-260) is built for versatility and everyday practicality, supporting flexible cargo configurations for commuting and family use, along with multiple riding modes and responsive power delivery for a smooth and stable ride. Its features are complemented by a removable battery design for convenient charging.

The Acer ES Series 3 Select e-scooter (AES033) emphasizes portability and efficiency. Equipped with features tailored for daily urban travel, it offers a lightweight, compact, and foldable design with multiple riding modes and features optimized braking and lighting systems.

Acer eMobility App Introduces New Voice Controls

The Acer eMobility app introduces new smartphone-based voice controls, enabling riders to check battery status and control lighting more easily on the go. The app also provides a unified interface for both e-bikes and e-scooters across Acer’s portfolio. It allows users to monitor vehicle status, battery levels, and riding data while providing functions such as lighting control, adjustment of device settings, access to riding history, and performance insights.

Through the app, there are also several security features that are tailored by vehicle type. On compatible e-scooters, riders can activate an e-lock function via voice commands; this automatically locks the system when the vehicle is moved and triggers an alarm. On e-bikes, the app provides alert-based anti-theft notifications to help riders stay informed of vehicle movement.

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WD at Computex 2026: AI Doesn't Just Run on Compute - It Runs on Data

Western Digital Corporation (Nasdaq: WDC), the storage foundation of the AI-driven data economy, today announced its presence at Computex 2026 to help the industry understand that AI infrastructure is fundamentally a data system, not just a compute system. Every AI workload - from training and inference to agentic and physical AI – continuously creates data that persists, compounds, and expands over time. This dynamic is fundamentally changing how businesses must design AI infrastructure for scale.

This shift exposes the core challenge for AI builders: managing exponential data growth while maintaining performance and economic efficiency at scale. How that data is managed determines whether AI delivers lasting business value or becomes an unsustainable cost. WD is at Computex addressing this reality with a forum session keynote, booth demonstrations and new storage innovations.

WD Chief Product Officer Ahmed Shihab will discuss why AI infrastructure can no longer be designed primarily around compute performance, and why persistent data growth, tiered architectures, and infrastructure economics are becoming the defining constraints of AI at scale.

“The shift toward AI-driven workloads is placing new demands on storage systems, requiring higher throughput, greater capacity, and improved reliability across multiple tiers,” said John Chen, Vice President at TRENDFOCUS. “WD’s advancements in HDD and platform technologies reflect the kinds of innovations needed to support increasingly data-intensive AI environments at scale.”

WD's exhibit brings this data-centric architecture to life, demonstrating how storage underpins AI systems at scale. Visitors will see WD's Ultrastar® HDD high-capacity storage portfolio spanning UltraSMR, ePMR and HAMR. The company will also be highlighting its two industry-first advanced HDD innovations: High Bandwidth Drive Technology and Dual Pivot Drive Technology, which together project a 4x increase in HDD throughput while maintaining the relative I/O per TB rate customers enjoy today. This reduces the need for customers to increase SSD deployment or rearchitect services as capacity scales.

WD’s Platform solutions highlighted will include the Ultrastar Data Series JBODs, OpenFlex® EBOF, and RapidFlex® NVMe-oF™ controller. These solutions help cloud, neo cloud and HPC companies accelerate adoption by optimizing capacity and performance, reducing costs, and improving time to value without requiring costly infrastructure designs. WD is also showcasing its new Ultrastar Data 3000 series JBODs, delivering the scalable capacity required for AI data growth. Using ArcticFlow™ multizone cooling and patented IsoVibe™ vibration isolation technologies, the Ultrastar Data 3000 series optimizes performance and reliability by reducing drive return rates by up to 62%1 in a platform designed for dependable operation at scale. The 3000 series also offers 12 ports of 24 Gb/s SAS‑4 host connectivity, enabling customers to stay ahead of bandwidth demands as capacity and workload intensities grow.

WD will also share tiered storage solutions, including architectures built on Ceph and others developed with IBM® Storage Scale and XTAO, that align performance and economics to each stage of the AI data lifecycle, increasing GPU efficiency while lowering cost at scale through tiered system-level architectures.

The globally recognized WD Color portfolio including WD Gold®, WD Red®, and WD Purple®, as well as the rebranded G-DRIVE® family of external storage solutions designed for content creators, will also be on display.

Together, these innovations position WD as a key foundational layer in AI infrastructure, enabling the persistence, movement, and scalability of data across environments.

“Computex is a great opportunity to connect with AI leaders and builders from around the world at a pivotal moment for the industry,” said Stefan Mandl, Vice President of Worldwide Sales and Marketing at WD. “AI is driving data growth at a scale and pace the industry has never seen before, and the organizations that recognize AI as a data system are the ones that will build AI that scales economically and efficiently over the long term. WD provides the durable, scalable and economically efficient data infrastructure foundation required to support AI systems over the long term.”

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