Cadence Introduces AuraStack AI Super Agent, the World’s First Agentic AI Platform for PCB and Advanced Packaging

Cadence (Nasdaq: CDNS) today introduced the AuraStack™ AI Super Agent on Cadence® Allegro® AI Studio, the world’s first agentic AI platform for printed circuit board (PCB) and advanced packaging design, taking designers from system planning to final product in a single AI-native environment. The Cadence AuraStack AI Super Agent, accelerated by NVIDIA Blackwell and NVIDIA CUDA-X, coordinates domain-specific AI agents across planning, implementation and tightly integrated multiphysics analysis domains to compress the system-design cycle through manufacturing. With the AuraStack AI Super Agent, Cadence is now the only provider with agentic AI solutions spanning the full electronic system design flow, from digital and analog silicon design, advanced packaging, through to PCB design, building on its ChipStack™, InnoStack™ and ViraStack™ AI Super Agents.

“The next era of AI infrastructure—spanning data centers, automotive, aerospace and physical AI—will be defined not only by silicon, but by the systems that connect, power and cool it,” said Michael Jackson, corporate vice president of R&D for System Design and Analysis at Cadence. “As hyperscale data centers deploy massive AI clusters and other industries advance increasingly intelligent, high-performance systems, engineering teams face growing complexity in PCB and advanced package design. Agentic AI orchestration, combined with trusted EDA and SDA tools, enables customers to move from manual iteration to intelligent, automated design realization.”

Agentic AI for Packaging and PCB Design

Building on the same architecture as Cadence’s ChipStack AI Super Agent, agentic AI is combined with principled simulation and optimization tools, leveraging a mental model of the design intent, to automate and orchestrate the design exploration, realization and signoff. The AuraStack AI Super Agent brings together automation and optimization for system planning, constraints management, physical structure definition, IP creation and reuse, place and route, design for manufacturability and multiphysics analysis across Cadence’s system design and analysis portfolio. It introduces a unified, AI-driven multiphysics foundation that concurrently models and optimizes electrical, thermal and mechanical behavior—including SI/PI, thermal, mechanical stress, drop, vibration and fatigue analysis—within a closed-loop environment, enabling earlier tradeoff evaluation and product-level optimization across the entire design flow. This continuous multiphysics feedback loop enables real-time design convergence, reducing late-stage surprises and improving overall system reliability.

The AuraStack AI Super Agent’s key benefits include:

• Accelerating time to market by 2X, with 15X productivity and multiphysics-driven quality—automating complex tasks, expanding design exploration.

• Unifying separate engineering teams around a shared, multiphysics-aware design environment with a single source of truth across domains.

• Advancing early and continuous multiphysics co-optimization to reduce late-stage rework and costly design iterations. Unifies Cadence multiphysics signoff solutions, such as Celsius™ Thermal Solver, Clarity™ 3D Solver for 3D-EM, MSC Nastran™ and Marc™ Linear and Non-Linear Finite Element Analysis Solvers for mechanical analysis, and Sigrity™ X Platform for signal and power integrity.

• Limiting expensive respins by identifying system issues earlier in development.

• Enabling product-level optimization, including co-optimization with advanced packaging approaches.

Industry Leaders Advancing Agentic AI with Cadence

Cadence is collaborating with industry leaders to deploy AuraStack AI Super Agent workflows for real-world advanced IC packaging and PCB design challenges.

NVIDIA is using Cadence to help automate and optimize increasingly complex system design workflows for its engineering teams.

“The scale and complexity of modern AI infrastructure demands a new design approach,” said Tim Costa, vice president and general manager of computational engineering at NVIDIA. “NVIDIA's collaboration with Cadence is advancing AI-powered engineering workflows that accelerate design convergence and innovation across the industry. The Cadence AuraStack AI Super Agent and the Millennium M2000 Supercomputer deliver up to 20X faster multiphysics performance, giving our engineers the capability to tackle the most demanding design challenges and bring the next generation of AI infrastructure to life.”

Cadence is partnering with TSMC to help customers accelerate advanced package implementation through AI-driven automation, enabling timely design convergence for increasingly complex multi-die systems.

“As advanced packaging complexity grows, customers need new levels of automation to achieve timely design convergence,” said Aveek Sarkar, director of the Ecosystem and Alliance Management Division at TSMC. “Our long-standing partnership with Open Innovation Platform® (OIP) ecosystem partners like Cadence to deliver advanced package design and verification solutions for TSMC 3DFabric® technologies helps customers accelerate the realization of next-generation multi-die systems for AI and high-performance computing applications. Through our multi-year collaboration on substrate auto routing, we are already enabling customers to boost productivity by 100X while delivering quality of results similar to manual routing.”

Socionext is leveraging Cadence to accelerate the automation and optimization of increasingly complex semiconductor package and PCB design workflows.

“AI-driven agents are set to transform IC package and PCB design by automating SI, PI and thermal workflows and enabling generative design,” said Iwasaki Toshifumi, lead design execution leading unit, Global Leading Group at Socionext Inc. “This acceleration allows our engineers to focus on higher-value work like architecture exploration, margin optimization, and multiphysics tradeoffs, while capabilities such as automated routing and chip-package-board co-design accelerate convergence and reduce manual effort.”

FORVIA HELLA continues to advance intelligent, sustainable mobility solutions that will define the future of automotive technology.

"Working closely with Cadence has fundamentally changed the way FORVIA HELLA develops advanced automotive electronics. Using AI-assisted placement technology, a task involving the placement of 300 components that previously took up to four days can now be completed in just four minutes,” said Sven Hoenecke, president & CEO, Electronics NSA at FORVIA HELLA. “This step change in productivity allows our engineers to evaluate more design alternatives, optimize layouts earlier in the development process, and accelerate the development of innovative products without compromising quality. By automating repetitive work, our teams can focus more time on solving complex engineering challenges and bringing new technologies to market faster.”

Schneider Electric is collaborating with Cadence to apply AI-driven design automation and engineering expertise to accelerate electronic design workflows and scale institutional knowledge across engineering teams.

"At Schneider Electric, we see AI as much more than a productivity tool. Our collaboration with Cadence has demonstrated the potential of AI to accelerate design activities and improve engineer efficiency,” said Daniel Gheno, senior vice president, Innovation and Technology EM at Schneider Electric. “The next frontier is to combine design automation with engineering expertise, enabling companies to capture decades of know-how and make robust design decisions available to every engineer. We believe this is where AI can truly transform electronic design."

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WD Malaysia Recognized for Advancing Sustainable AI Infrastructure

As AI adoption accelerates globally, so does the need for data infrastructure that can scale responsibly. Western Digital Corporation (Nasdaq: WDC), the sustainable storage foundation of the AI-driven data economy, is committed to helping customers store more data with greater efficiency, reducing the physical footprint, energy consumption, and resources required to support the world's rapidly growing AI workloads.

Today, WD's Malaysia operations gained recognition for that commitment, earning three prestigious recognitions from the Sustainability & CSR Malaysia Awards 2026 and the Asia Sustainability Personality Awards 2026, spanning corporate, leadership, and practitioner categories. The honors reflect WD's long-term commitment to embedding sustainability across every layer of its operations – from the manufacturing floors of Sarawak, Penang, and Johor to the data infrastructure powering AI worldwide.

The awards, which are organized by CSR Malaysia Publication and the Corporate Sustainability & Responsibility Malaysia Welfare Society, recognize outstanding corporations that have excelled in helping drive the country’s sustainable socio-economic transformation.

WD Malaysia was honored with the Company of the Year Award (Manufacturing & Technology) under the Green Innovation & Sustainability Transformation category at the Sustainability & CSR Malaysia Awards 2026. Meanwhile, the Asia Sustainability Personality Awards 2026 gave Dr. Chandramogan Anamirtham, Senior Vice President of Global Operations at WD, the ESG Visionary Leader Award, while Ts. Freddy Kho, Manager of Environmental Health & Safety at WD, was recognized with the Sustainability Practitioner Award. The recognitions reflect WD’s long-standing commitment to responsible, sustainable, and future-ready manufacturing operations that are critical for delivering the storage foundation that the world’s leading cloud and enterprise customers trust to power their AI infrastructure.

Across its Malaysia operations, WD continues to advance operational excellence, environmental responsibility, and workforce development as part of its broader commitment to meeting global data storage demand. As AI infrastructure expands around the world, innovation in storage efficiency plays an increasingly important role in reducing the environmental impact associated with managing exponentially growing volumes of data. Central to this is WD's focus on developing storage technology that makes AI infrastructure more efficient, helping customers scale AI infrastructure more efficiently including increasing storage density while reducing power consumption, cooling requirements and physical infrastructure.

WD’s CSR leadership across Malaysia also supports the company's broader global sustainability targets, including 100% carbon-free energy by FY30 and net zero Scope 1 and 2 emissions by FY32. The WD Sarawak site is also advancing sustainability through a Renewable Energy Certificate (REC) agreement with Sarawak Energy Bhd, enabling 100% Scope 2 market-based emissions reduction since FY2024. This complements WD’s advanced substrate production and an enhanced glass substrate facility in supporting AI-driven storage innovation.

Driving sustainability at the corporate and individual levels

The corporate award recognizes WD Malaysia’s efforts focused on energy responsibility, resource efficiency, innovation, employee engagement and community impact. Dr. Chandramogan’s ESG Visionary Leader Award recognizes his role in championing sustainability as a strategic pillar of responsible manufacturing and business growth, while Ts. Freddy Kho’s Sustainability Practitioner Award recognizes his contribution to translating sustainability priorities into operational practices that strengthen WD Malaysia’s manufacturing excellence.

Dr. Chandramogan Anamirtham, SVP, Global Operations at WD, shared, “At WD, sustainability is not separate from manufacturing excellence – it is fundamental to how we innovate, operate and grow. Being honoured with these sustainability recognitions reflects the collective dedication of our teams across Malaysia and the world to advance responsible manufacturing and sustainable operations, and create long-term value for our employees, customers, and the broader technology ecosystem.”

“As global demand for AI-driven data storage accelerates, our commitment to responsible manufacturing has never been more critical. Every improvement we make in our operations ultimately helps customers build AI infrastructure more efficiently, storing more data while using less power, space, and resources. WD remains committed to advancing that journey through innovation, collaboration, and disciplined execution,” he added.

Beyond manufacturing, WD Malaysia invests in initiatives that create long-term value for local communities and the technology ecosystem. Through education partnerships, STEM programs, employee volunteerism, and community engagement, the company helps nurture future innovators and supports Malaysia’s digital and industrial transformation.

These recognitions affirm WD’s belief that innovation and sustainability must advance together. Sustainability is no longer just about how technology is manufactured, it is also about how efficiently it enables the world's growing AI infrastructure. As AI continues to drive unprecedented data growth, the future will depend not only on more powerful infrastructure, but on infrastructure that uses resources more efficiently. Through continued innovation in storage density, manufacturing, and operational excellence, WD is helping customers build AI infrastructure that scales both economically and responsibly.

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Rapidus and Cadence Partner on Agentic AI for Advanced SoC Design

Rapidus Corporation and Cadence (Nasdaq: CDNS) today announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads). The joint effort combines Rapidus’ AI-native design and manufacturing ecosystem for advanced-node semiconductors with Cadence’s agentic AI design orchestration technology to help design teams improve productivity, accelerate time to market and enhance design quality across the SoC design lifecycle. As part of this collaboration, Rapidus is targeting up to a 2X improvement in design turnaround time (TAT) over traditional flows.

The buildout of AI infrastructure, and the coming wave of physical AI-powered systems, requires tight, system-level co-optimization across semiconductor design, manufacturing, packaging and systems. Agentic AI is critical for this next generation of advanced SoCs. As part of today’s announcement, Rapidus is extending its Raads lineup with the introduction of Raads Navigator and Raads Indicator to enhance quality assurance and support designers in resolving design issues and challenges. Significantly, the new tools have been integrated with the Cadence InnoStack AI Super Agent to enable agentic design orchestration across key SoC workflows, automating and coordinating tasks from early architectural exploration through implementation and signoff. By applying data-driven optimization across the design lifecycle, the integration is intended to help teams manage advanced-node complexity, improve design predictability and scale engineering productivity while driving toward Rapidus’ design TAT reduction goals.

“Advanced-node SoC design increasingly requires AI agents that can orchestrate complex workflows across the design lifecycle, not just optimize individual tasks,” said Anirudh Devgan, president and CEO, Cadence. “By combining Cadence’s InnoStack AI Super Agent with Rapidus’ Raads platform, we are extending agentic AI into a leading-edge semiconductor ecosystem, enabling customers to improve productivity, accelerate design closure and bring more advanced silicon to market faster.”

Rapidus and Cadence will discuss the collaboration at CadenceLIVE Japan 2026, where Dr. Atsuyoshi Koike, representative director and CEO of Rapidus will deliver a keynote on how Rapidus is evolving Raads with Cadence Agentic AI and EDA to improve efficiency and quality in advanced-node SoC development.

“At its completion, our Innovative Integration for Manufacturing facility will be the most advanced, AI-native foundry where AI is incorporated at almost every stage of semiconductor manufacturing,” said Koike. “By evolving Raads and integrating it with Cadence’s InnoStack AI Super Agent, we are strengthening our AI-agentic design environment to help customers manage increasing SoC complexity, improve engineering productivity and realize the full value of Rapidus’ advanced process technologies. In working closely with Cadence on InnoStack and additional Cadence AI Super Agent solutions, we see a clear path to significantly reducing design turnaround time and enabling faster innovation on Rapidus’ advanced nodes.”

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Canon Malaysia and Penang Hill CorporationForge 5-Year Partnership to Advance Conservation Through Imaging Technology

Canon Marketing Malaysia (“Canon”) and Penang Hill Corporation (PHC) have formalised a five-year strategic collaboration to support conservation, biodiversity documentation, and environmental awareness initiatives at Penang Hill.

Under the collaboration, Canon has been engaged as the Official Imaging Partner of PHC, contributing its imaging technologies and expertise in professional cameras and high-quality print solutions to help document and showcase the ecological significance and beauty of the Penang Hill Biosphere Reserve (PHBR). Canon has been a strong supporter and active sponsor of the Penang Hill Festival since its inception in 2018.

Designated as a UNESCO Biosphere Reserve under the Man and the Biosphere (MAB) Programme since 2021, the Penang Hill Biosphere Reserve (PHBR) covers Penang Hill and its surrounding areas, spanning 12,481 hectares and home to more than 2,000 species of flora and over 500 species of fauna, making it Malaysia’s only urban-adjacent coastal and terrestrial rainforest ecosystem of its kind.

The partnership will support PHC’s ongoing biodiversity conservation and environmental awareness initiatives in collaboration with Canon, including bird biodiversity documentation, photography and videography workshops, conservation exhibitions, and the development of birdwatching spots across Penang Hill.

“Guided by the philosophy of ‘kyosei’, living and working together for the common good, this partnership reflects our commitment to environmental stewardship and community engagement. We believe imaging can be a powerful tool to elevate conservation and awareness efforts. Through this partnership, we are bringing Canon's strengths in imaging to support the documentation of Malaysia’s natural heritage while encouraging greater appreciation for biodiversity,” said Masato Yoshiie, President and CEO of Canon Marketing Malaysia.

Dato’ Cheok Lay Leng, General Manager of Penang Hill Corporation, added, “Penang Hill is not only a popular ecotourism destination, but a vital biodiversity and ecological asset that must be preserved responsibly. As a Biosphere Reserve, it serves as a living laboratory and testbed for conservation, research, and education, supported by community participation.

This partnership strengthens our commitment to biodiversity conservation and environmental awareness by enhancing documentation efforts and public engagement. It further reinforces Penang Hill Biosphere Reserve’s vision as a model for sustainable tourism and environmental stewardship, delivering lasting benefits for nature and future generations.”

As part of the collaboration, Canon will provide professional cameras and lenses to support PHC’s Bird Documentation Project, creating a long-term visual archive of bird species within the Biosphere Reserve. This archive will serve as a valuable reference for research, education, and conservation awareness, developed in close collaboration with the Malaysian Nature Society (MNS), drawing on their expertise in birds.

Both PHC and Canon will also jointly organise annual photography and videography workshops at Penang Hill, including programmes held during the Penang Hill Festival, to encourage greater public appreciation for nature conservation through visual storytelling.

In addition, selected bird photographic works featuring native and migratory species found at Penang Hill will be exhibited at the Penang Hill Station, while five dedicated birdwatching spots will be introduced to improve accessibility for visitors, photographers and birdwatching enthusiasts.

The collaboration reflects the shared commitment of PHC and Canon towards conservation, biodiversity awareness, and sustainable public engagement, bringing together environmental stewardship and imaging expertise.

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Dell Technologies Delivers Production-Ready Agentic AI from Deskside to Data Cente

Dell Technologies (NYSE: DELL) introduces Dell Deskside Agentic AI, a new addition to the Dell AI Factory with NVIDIA that gives workgroups the ability to deploy and scale agentic AI workflows locally without the cost, latency and data sovereignty constraints of cloud-only approaches. With the NVIDIA OpenShell runtime now supported across the entire Dell AI Factory with NVIDIA, enterprises benefit from a single security and policy enforcement layer from deskside workstations to Dell PowerEdge XE servers.

As AI workflows shift toward agentic architectures, token usage compounds at an accelerating rate, driving cloud costs that can quickly become unsustainable despite falling token prices. Cloud-only strategies fall short on what matters at scale: economics, security and data sovereignty. Organizations running agentic AI need infrastructure that addresses all three and scales with workloads without requiring a rebuild every time they mature.

The Dell AI Factory with NVIDIA delivers an enterprise-ready path from the desk where decisions are made to the data center where they scale. For agentic AI workloads of various sizes, organizations can break even versus public cloud API costs in as little as three months with Dell Deskside Agentic AI.1 Deskside systems keep inferencing local, costs predictable and data secure, giving businesses greater control over their AI environment. NVIDIA OpenShell gives developers and IT teams a secure, sandboxed environment to build, deploy and govern AI agents across the Dell AI Factory with NVIDIA from workstations to servers. Teams can build and iterate more freely while reducing exposure to unpredictable cloud inference costs, bandwidth expenses and IP risks.

Dell Deskside Agentic AI is built around the reality that roughly over 50% of agentic workflows run on open-weight models.2 This is where the 30-billion to 284-billion parameter model range performs bulk reasoning that efficiently drives operations forward. From coding assistants and research agents to highly secure, private AI assistants for regulated industries, the solution offers a range of Dell high-performance workstations, each sized for different workload and budget requirements. These pair with the NVIDIA NemoClaw reference stack and Dell Services to handle heavy AI workloads wherever they make the most economic sense. With Dell Deskside Agentic AI, organizations can reduce spend up to 87% compared to cloud APIs, over two years.3

Dell Pro Max with GB10: Compact and power-efficient system for small-scale, individual agent prototyping, starting with 30 billion up to 200 billion parameter models.

Dell Pro Precision 9: Enterprise workstation towers featuring Intel Xeon 600 processors for workstation and up to five NVIDIA RTX PRO Blackwell Workstation Edition GPU configurations, providing scalable performance for workhorse‑class GPU workloads and supporting models from 30 billion to 500 billion parameters.

Dell Pro Max with GB300: Powered by the NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip and Dell’s exclusive MaxCool technology for peak efficiency, this platform is purpose-built for inference of frontier-level AI models from 120 billion up to 1 trillion parameter models.

NVIDIA NemoClaw reference stack: An open-source foundation for securely managing always-on AI agents built on OpenClaw, the agentic framework that powers persistent, autonomous, multi-step AI workflows on local hardware. The stack combines high-performance NVIDIA Nemotron open models for reasoning and coding, and OpenShell's secure runtime — all part of the NVIDIA Agent Toolkit for building and orchestrating long-running agents.

Dell Services: End-to-end guidance through the full agentic AI lifecycle – from initial strategy and hardware deployment to workflow alignment, agent prioritization and ongoing optimization – accelerating time-to-production and closing internal AI skills gaps.

Deploying agentic AI in production requires a consistent framework that protects sensitive data, integrates with current operations and covers the full infrastructure stack. NVIDIA OpenShell, now supported across the entire Dell AI Factory with NVIDIA, gives organizations a sandboxed environment to build, deploy and govern agents with privacy and security controls at runtime. It spans Dell high-performance workstations through Dell PowerEdge XE servers on Canonical Ubuntu and Red Hat AI in the Dell AI Factory with NVIDIA. Developing and deploying agents closer to data improves governance, security and operational control.

NVIDIA AI-Q 2.0 blueprint support gives organizations a tested foundation to deploy multi-agent workflows handling research, decision support and complex tasks, accelerating the move from pilot to production. Now available as the Dell-NVIDIA AI-Q 2.0 Reference Architecture, powered by Dell AI Data Platform, it is engineered for demanding on-premises workloads in regulated industries including financial services, public sector and manufacturing.

Jeff Clarke, chief operating officer, Dell Technologies:

“The most efficient token is the one produced closest to the data, and most enterprise data isn't in the cloud. Dell Deskside Agentic AI gives every workgroup a secure local environment to run agents, keep costs predictable and keep IP inside the building. What works at the desk scales to the data center. That's a deployment model for the next decade.”

Justin Boitano, vice president, AI Platforms, NVIDIA:

“As enterprises reshape and scale the future of work with agentic AI, they’re seeking infrastructure that spans the full enterprise — from our desks where work happens to the AI factories where intelligence scales. With NVIDIA OpenShell across the Dell AI Factory with NVIDIA, enterprises can develop locally, scale securely and deploy agentic AI on one consistent platform.”

Ryan Shrout, president, Signal65:

“As enterprises transition from AI experimentation to full-scale production, the need for secure, scalable and cost-effective infrastructure has never been greater. Dell Deskside Agentic AI, as part of the Dell AI Factory, bridges the gap between local control and enterprise scalability, while providing headroom for continued iteration. This deskside to data center capability is unique and empowers organizations to harness the full potential of agentic AI while maintaining data sovereignty and predictable costs.”

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Cadence Announces Collaboration with Intel Foundry to Accelerate Intel 14A Process Optimization for HPC and Mobile Designs

Cadence (Nasdaq: CDNS) today announced an expanded collaboration with Intel Foundry to advance Design Technology Co-Optimization (DTCO) targeting Intel’s next-generation process technologies, beginning with Intel 14A. The new multi-year agreement combines Cadence’s agentic AI-driven EDA and Design IP solutions with Intel’s process innovation and advanced design expertise. 

The DTCO collaboration focuses on optimizing tools, flows, and methodologies to deliver industry-leading performance, power, and area (PPA). Cadence and Intel will work closely to optimize Intel 14A to deliver production-ready PDKs. The collaboration will also leverage Cadence’s agentic AI flows and core products to accelerate time-to-market and reduce design risk. 

“Advancing our relationship with Intel into a much deeper partnership is a major milestone for both companies,” said Anirudh Devgan, president and chief executive officer, Cadence. “This collaboration will leverage the strengths of both companies to empower customers to unlock new levels of performance, power, and efficiency, advance the state of the art and accelerate the realization of next-generation products.”

“Our expanded collaboration with Cadence reflects Intel Foundry’s continued focus on delivering on its technology roadmap and ecosystem on behalf of our customers,” said Naga Chandrasekaran, executive vice president and general manager of Intel Foundry. “By combining Intel’s process and packaging with Cadence’s AI-driven design tools, we are enabling deeper co-optimization, strengthening our ability to deliver on customers’ needs, and showcasing the ability of both companies to drive innovation at scale.”

About Cadence

Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems. Our design solutions, based on Cadence’s Intelligent System Design™ strategy, are essential for the world’s leading semiconductor and systems companies to build their next-generation products from chips to full electromechanical systems that serve a wide range of markets, including hyperscale computing, mobile communications, automotive, aerospace, industrial, life sciences and robotics. In 2024, Cadence was recognized by the Wall Street Journal as one of the world’s top 100 best-managed companies.

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A10 Networks Acquires TrojAI to Strengthen Sovereign AI Security for Enterprise Workflows

Networking and cybersecurity leader A10 Networks (NYSE: ATEN) has officially announced the acquisition of TrojAI, an innovative security firm specializing in the protection, testing, and governance of artificial intelligence applications. The strategic move significantly enhances A10's security portfolio, allowing the company to deliver robust "sovereign AI" security solutions. By integrating TrojAI's specialized technology, A10 aims to provide enterprise customers with precise, localized control over how and where their proprietary AI models, corporate data, and autonomous agentic workflows are shielded from emerging digital threats.

“AI is changing both what enterprises build and the attack surface they have to defend, and traditional controls weren’t designed for non-deterministic models and autonomous agents,” said Dhrupad Trivedi, President and Chief Executive Officer of A10 Networks. “TrojAI is a natural fit for A10, strategically and operationally. Pairing our hardware-based AI firewall with TrojAI’s software-based red teaming and runtime protection helps customers adopt AI quickly and confidently, protecting their models, data, and agents without sacrificing the latency or availability they rely on us for, whether on-premises, in the cloud, or hybrid. For customers with strict data-sovereignty requirements, it means embracing AI while keeping their most sensitive assets in environments they control.”

Following the acquisition, A10 expects to integrate TrojAI’s capabilities into its evolving security portfolio, letting customers run secured AI wherever their data resides.

“Enterprises and public-sector organizations are adopting AI at an unprecedented pace, and they need to innovate securely while maintaining sovereignty over their AI security infrastructure,” said Lee Weiner, Chief Executive Officer of TrojAI. “Together with A10, we can secure and govern the models, agents, and applications becoming core to how organizations operate. I’m proud of what our team has built, and excited to bring these capabilities to A10’s customers and channels.”

This acquisition is not a change in direction. It is an acceleration of a strategy we have been building for the past two years which is helping enterprises securely adopt AI technologies as data center architectures evolve and AI systems move into production at scale.

Key Takeaways

• A10 Networks' acquisition of TrojAI accelerates its enterprise AI security roadmap with red teaming, runtime firewall enforcement, and agentic protocol support

• TrojAI's native Model Context Protocol support positions A10 Networks ahead of the market in securing agentic AI workflows

• TrojAI's red-teaming findings feed back into A10's guardrail models in near real time, improving protection against production-scale threats

• The combined portfolio integrates AI security across ADC, DDoS, application, and API, serving Fortune 50 organizations at scale

TrojAI delivers capabilities that directly align with A10’s AI security strategy and materially accelerate our product roadmap. The acquisition of TrojAI directly advances A10’s long-term objective to build a comprehensive enterprise AI security suite. This is not an overlap or consolidation of similar tools. TrojAI adds production-grade AI security infrastructure that helps translate A10’s model intelligence into deployable protections for enterprise workflows. The synergy provides an immediate, low-friction acceleration of our AI security mission: no application instrumentation, no custom architecture work, and no heavy deployment lift.

TrojAI’s customer base includes Fortune 50 organizations, providing strong market validation of both the urgency of AI security challenges and the effectiveness of its solutions. Its platform maturity reflects repeated enterprise feedback cycles, and its team brings AI safety and infrastructure engineering expertise that strengthens A10’s execution capacity.

TrojAI’s strengths in production-grade red teaming, runtime AI firewall enforcement, agentic protocol support, and browser-based endpoint protection significantly expand the speed and scope of what we can deliver to customers.

Further, TrojAI’s native compatibility with the Model Context Protocol positions A10 early in securing agentic AI workflows — an area where enterprise demand is emerging rapidly and where TrojAI is meaningfully ahead of our internal roadmap.

One of the most powerful aspects of this acquisition is the feedback loop it creates. Red-teaming findings from Troj Detect inform model updates and guardrail intelligence improvements in near real time. This continuously trains A10’s AI models against threat vectors observed in production at Fortune 50 scale.

This acquisition expands not only our product capabilities, but also our engineering bandwidth and AI specialization at a critical moment in market evolution. Combined with A10’s proprietary guardrail models and model intelligence, the capabilities expand our enterprise AI security portfolio and strengthen the growth story for customers and investors: faster roadmap execution, and differentiated protection across ADC, DDoS, application, API, and AI security.

A10’s global footprint, operational scale, and deep enterprise relationships provide TrojAI with growth opportunities that would be difficult to achieve independently. The combined portfolio positions A10 distinctly in the market by offering capabilities that pure-play AI security vendors cannot match in terms of networking depth, deployment scale, and platform maturity, while also moving faster and more decisively than larger infrastructure providers that are still early in AI-specific security productization, all while preserving and strengthening A10’s established leadership in ADC, DDoS protection, and application security.

With this acquisition the A10 Networks portfolio is positioned to help customers deliver and secure AI-enabled applications at scale, to secure agentic applications and workflows, ensuring the ongoing operational safety of deployed models. Coupled with our existing infrastructure elements, and leading application and API defense platform, we are positioned to secure the applications of tomorrow, today. Together, we can bring AI security innovation to the world’s largest organizations with the reliability, scalability, and support they expect from A10.

A10 does not expect the acquisition to have a material impact on its financial results for fiscal year 2026. It is squarely positioned to help secure AI buildouts and application rollouts in the next 2-5 years.

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Cadence Level-5 ChipStack Cuts Semiconductor Verification Cycles From Five Weeks to Under a Day

Chip verification bottlenecks may soon become a thing of the past following Cadence’s COMPUTEX 2026 launch of its Level-5 ChipStack™ AI Super Agent. Developed in deep collaboration with NVIDIA, the autonomous engineering framework integrates directly with Cadence’s signature Xcelium™ Logic Simulation and Jasper® Formal Verification engines to supercharge debugging cycles. In massive internal tests, thousands of engineers deploying these autonomous agents achieved a staggering 40X acceleration in RTL validation. By compressing a traditional, grueling five-week verification loop down to less than 24 hours, the platform resolves one of the costliest and most labor-intensive bottlenecks in modern semiconductor development.

“We see our customers using AI to let their expert engineers take on more ambitious silicon designs with greater speed and confidence,” said Paul Cunningham, senior vice president and general manager of the System Verification Group at Cadence. “With the ChipStack AI Super Agent, we’re taking the next step—moving from AI that assists engineers to autonomous virtual engineers that can implement real design and verification work, grounded in our signoff-accurate engines and running in secure, governed environments so teams can innovate faster with confidence.”

From AI Assistance to Autonomous Engineering

The ChipStack AI Super Agent now operates at Level-5 autonomy, independently executing complex chip design and verification workflows while allowing engineers to inspect, guide and collaborate as needed. Native integration with collaboration environments and compatibility with tools like Codex or Claude Code, provides transparency into autonomous activity, helping teams stay connected to the system’s progress and decisions.

Rather than relying on step-by-step prompts, the ChipStack AI Super Agent evaluates intermediate results, determines next actions and iterates toward closure across tasks such as specification understanding, RTL generation, verification planning, formal analysis, simulation, debug and design convergence. This shifts engineers from executing individual tasks to supervising outcomes and guiding intent, as autonomous verification workflows shrink validation cycles that traditionally took weeks down to less than a day in leading-edge deployments.

Grounded in Engineering Truth, Secured for Production

A key Cadence differentiator is that autonomous agent behavior is tightly coupled with the company’s core physics-based design and verification engines. This keeps AI-directed actions grounded in proven computational models and signoff-accurate results, creating the trust needed for high-stakes engineering programs.

To support production deployment, the ChipStack AI Super Agent is run within the NVIDIA OpenShell runtime, a sandboxed environment for autonomous agents that enforces governance and helps protect sensitive IP through policy controls, isolation and managed access to tools, infrastructure and design data. Together, Cadence’s physics-based engines and OpenShell’s security architecture provide a practical path from supervised pilots to production-grade autonomous flows.

“As semiconductor designs grow more complex, engineering teams need AI agents that can accelerate verification without compromising security, control or trust,” said Timothy Costa, vice president and general manager of computational engineering at NVIDIA. “By securing Cadence's ChipStack AI Super Agent with NVIDIA OpenShell and powering it with Nemotron models, Cadence is bringing governed autonomy to chip design workflows — giving customers a faster, more secure path to develop and validate advanced semiconductors.”

Leading the Next Era of Agentic AI

This announcement reflects the speed of Cadence innovation in agentic AI, powered by NVIDIA. Following the acquisition of ChipStack in November 2025, Cadence launched its first product in February 2026 and expanded into a portfolio of AI super agents at CadenceLIVE in April, introducing ViraStack AI Super Agent for custom and analog design, InnoStack AI Super Agent for digital implementation and signoff, and Cadence AgentStack as the orchestration framework for coordinating agentic workflows across the design stack. Cadence is now extending those capabilities to full autonomy.

Availability

The Level-5 autonomous capabilities of the ChipStack AI Super Agent and the AgentStack orchestration framework are expected to be available to early-access customers in the second half of 2026.

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Aeva Adopts Cadence Tensilica Vision DSP to Advance Lidar Performance and Efficiency

Cadence announced that Aeva, a leader in next-generation sensing and perception systems, has licensed Cadence® Tensilica® Vision DSP IP to accelerate signal processing in its 4D LiDAR systems—enabling flexible and scalable solutions for industrial robotics and automotive applications. This design win marks a significant step in delivering high-performance, low-power lidar systems optimized for real-time perception and autonomy.

Lidar technology enables precise 3D mapping and object detection in robotics, autonomous vehicles, industrial automation and other physical AI applications at the edge. Its ability to deliver high-resolution depth information makes it indispensable for safety and navigation. Aeva’s 4D LiDAR technology goes a step further by detecting velocity and position simultaneously, empowering autonomous devices to make safer, more intelligent decisions.

Cadence Tensilica Vision DSPs deliver a unique combination of programmability and performance, enabling Aeva to add flexibility, scalability and customizations to the lidar processing pipeline. Their inherent low-power architecture and customizable Tensilica Instruction Extension (TIE) language make Tensilica DSPs ideal for real-time signal processing, where latency and efficiency are critical.

“Cadence’s DSP technology provides the flexibility and performance uplift we need to push the boundaries of perception and deliver scalable solutions to our industrial and automotive customers,” said James Reuther, chief engineer of Aeva. “By integrating the Tensilica Vision DSP into our next-generation LiDAR systems, Aeva can leverage the powerful combination of Cadence’s highly configurable hardware and comprehensive suite of optimized software libraries to accelerate innovation and bring advanced sensing capabilities to market faster.”

“Cadence is committed to enabling our customers to build smarter, safer and more connected systems for edge and physical AI applications, and we look forward to collaborating with Aeva to redefine perception with their groundbreaking 4D LiDAR technology,” said Amol Borkar, group director of product management and marketing for Tensilica DSPs at Cadence. “Our Tensilica DSPs empower SoC providers to deliver differentiated performance and power efficiency in leading-edge, low-latency applications like lidar.”

Aeva is the latest in a growing list of companies leveraging Tensilica Vision DSPs to drive innovation across industrial robotics, autonomy and other physical AI applications. Tensilica Vision DSPs come with industry-leading software libraries optimized for neural networks, computer vision, simultaneous localization and mapping (SLAM), radar and point cloud processing. In addition, Tensilica DSPs are equipped with a third-generation neural network compiler, the NeuroWeave SDK, which enables execution of the latest AI networks proliferating in the lidar segment. With a proven track record in ADAS, radar, audio and vision processing, Tensilica DSPs remain the go-to solution for high-performance, low-power and customizable processor IP.

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Cadence and Google Collaborate to Scale AI-Driven Chip Design with ChipStack AI Super Agent on Google Cloud

Cadence, an industry leader in AI-driven computational software for semiconductor and system design, today announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud. This collaboration positions Cadence at the forefront of the shift toward agentic design automation, creating an agent-driven, scalable, cloud-native platform for next-generation chip design and verification.

The Cadence ChipStack AI Super Agent integrates advanced agentic reasoning with Cadence’s EDA solutions, delivering up to 10X productivity improvements across digital design and testbench development, verification planning, regression management and automated debug. By combining AI agents with native EDA execution, the platform enables design teams to compress development cycles, improve efficiency and accelerate time to tapeout.

“Our collaboration with Google Cloud represents a major step forward in scaling AI-driven design automation,” said Paul Cunningham, senior vice president and general manager at Cadence. “By integrating the Cadence ChipStack AI Super Agent with Gemini, we’re advancing the next generation of agentic design—combining the reasoning power of large language models with Cadence’s world-class EDA engines to deliver breakthrough productivity and quality of results for our customers.”

At the core of the ChipStack AI Super Agent is its innovative Mental Model technology, which enables sophisticated agentic reasoning through Cadence native skills, driving Cadence EDA tools to improve the quality and correctness of large language model (LLM)-generated content. Through its collaboration with Google Cloud, Cadence is tightening the integration between the Gemini-enabled ChipStack AI Super Agent and Cadence EDA engines, driving significant improvements in both productivity and quality of results.

This collaboration also leverages Google Cloud’s secure, elastic compute infrastructure to deliver the compute needed for Gemini’s LLM reasoning, Cadence EDA tools and the ChipStack AI Super Agent. This enables a “click-to-deploy” end-to-end solution for agent-powered chip design and verification.

The ChipStack AI Super Agent is available now on the Google Cloud Marketplace. 

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Kingston Fuels the Next Wave of Industrial Digital Transformation

As digital transformation sweeps across the Asia-Pacific region, Kingston Technology is doubling down on its "Built on Commitment" philosophy to support the rapid rise of Industrial PCs and edge computing. With automation and mission-critical operations becoming the backbone of modern industry, the demand for hardware that offers uncompromising reliability has never been higher. Kingston is positioning itself as a central pillar in this shift, providing the foundational memory and storage solutions required to power everything from advanced manufacturing to smart digital infrastructure.

Kingston’s leadership in memory and storage is driven by its “Built on Commitment” philosophy, delivering performance, quality, reliability, and service across its global portfolio. From the Kingston FURY line for gamers and content creators to high-performance SSDs, external storage, DRAM, USB drives, memory cards, and IronKey encrypted solutions, Kingston supports a wide range of consumer and professional applications. Recognized as the No.1 in channel SSDs for eight consecutive years and the No.1 third-party supplier of DRAM modules for 22 years, Kingston has long supported Industrial PC and enterprise infrastructure, with the same reliability, consistency, and long-term performance that have defined the brand.

Design-In Memory and Industrial SSD Solutions

To support mission-critical deployments, Kingston offers a specialized portfolio of Design-In memory and Industrial SSD solutions tailored for system designers, OEMs, and integrators. Kingston provides controlled BOM and firmware consistency, PCN support, lifecycle management, and global technical support, helping partners maintain component stability, streamline system integration, and ensure long-term deployment reliability.

• Design-In Memory Solutions: Kingston’s Design-In DRAM modules are built to JEDEC industry specifications and engineered to deliver consistent performance and long-term stability for industrial and embedded systems.
• Industrial Solid-State Drives: Kingston’s Industrial SSD lineup includes SATA and NVMe solutions in multiple form factors, supporting both commercial and industrial operating temperature ranges. Equipped with advanced controllers, wear-leveling, garbage collection, and 3D NAND technologies, these drives deliver reliable, high-performance storage for demanding industrial environments. 

By collaborating closely with partners from early development stages, Kingston enables stable, long-term system performance and dependable supply across applications ranging from retail and transportation to logistics, surveillance, networking, and industrial automation.

“Industrial PC deployments are accelerating rapidly across industries, placing a sharper spotlight on long-term reliability and performance,” said Kevin Wu, Sales, Marketing and Business Development Vice President, APAC.  “Today’s customers expect more than just components—they require stability, lifecycle transparency, and a supply chain they can trust. Through our Built on Commitment philosophy, Kingston delivers memory and storage solutions designed to support the long-term success of our partners’ systems.”

As Industrial PCs, edge computing, and intelligent systems continue to evolve, Kingston remains Built on Commitment—working alongside its partners to deliver the reliability, consistency, and long-term support required to build resilient, scalable systems. Through this philosophy, Kingston continues to power advanced innovation and sustain the next generation of infrastructure, today and into the future. 

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LG Electronics Brings Together Asian HVAC Partners at LG HVAC CONNECT ASIA 2026

LG Electronics (LG) brought together its top-tier HVAC partners from across Asia at LG HVAC CONNECT ASIA 2026, held in Seoul, Korea, from April 13–16. The event welcomed more than 70 guests from 15 countries and highlighted LG’s HVAC business strategy and solutions tailored to the Asian market, further strengthening collaboration while supporting partners’ business growth and expansion.

 

LG’s HVAC Strategy and Key Technologies

At the conference, LG presented its vision for HVAC business in Asia, supported by core technologies spanning system air conditioners, residential air conditioners, air care and data center cooling. The sessions were closely connected to the exhibition, linking the technologies introduced on stage with product demonstrations to help partners better understand both the concepts and their practical applications.

Regionally Tailored HVAC Solutions

The exhibition featured HVAC solutions designed for diverse business environments across Asia, offering partners insight into locally relevant applications. One of the key highlights was the Multi V™ 5 Pro2 outdoor unit for system air conditioners, which uses AI-based control to help improve energy management and operational efficiency. Its AI Smart Care and AI Energy Management functions automatically adjust cooling performance and energy use based on real-time data, delivering energy savings of up to approximately 60 percent depending on operating conditions.*

LG also shared best practice cases from across the region. These included the BECON building energy management platform used in franchise stores in the Philippines, which enables centralized monitoring and control of energy systems across multiple locations to support more efficient operations. In Thailand, a mid-static ducted unit equipped with IoT modules and oil-mist filters has proven effective in managing cooking vapor in restaurant environments.

Looking ahead, LG presented its future vision for intelligent HVAC systems, centered on the AI-based Variable Refrigerant Flow solution Multi V i, and showcased AI-applied products including the DUALCOOL™ and ARTCOOL™ residential air conditioners, the WallFit air purifier and data center cooling solutions.

Practical Insights Through Meetings and Site Visits

Dedicated business meetings and on-site tours provide attendees with practical insight throughout the event. Organized into two tracks, the meetings covered both short-term opportunities and mid- to long-term projects, allowing partners to explore a wide range of business potential. The program also included visits to LG’s chiller factory in Pyeongtaek, Gyeonggi-do, and the company’s flagship store D5 in Gangnam, Seoul, where partners could observe production and experience LG’s technologies and solutions in real-life environments.

“LG HVAC CONNECT ASIA 2026 gives our partners an opportunity to better understand our technologies and see how they can be applied in their own business settings,” said James Lee, president of the LG ES Company. “Our goal is to continue building on our collaboration so we can create a stronger path to success together, helping our partners grow through solutions based on real operational needs.”

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Meta Builds AI Infrastructure With NVIDIA

NVIDIA today announced a multiyear, multigenerational strategic partnership with Meta spanning on-premises, cloud and AI infrastructure.

Meta will build hyperscale data centers optimized for both training and inference in support of the company’s long-term AI infrastructure roadmap. This partnership will enable the large-scale deployment of NVIDIA CPUs and millions of NVIDIA Blackwell and Rubin GPUs, as well as the integration of NVIDIA Spectrum-X™ Ethernet switches for Meta’s Facebook Open Switching System platform.

“No one deploys AI at Meta’s scale — integrating frontier research with industrial-scale infrastructure to power the world’s largest personalization and recommendation systems for billions of users,” said Jensen Huang, founder and CEO of NVIDIA. “Through deep codesign across CPUs, GPUs, networking and software, we are bringing the full NVIDIA platform to Meta’s researchers and engineers as they build the foundation for the next AI frontier.”

“We’re excited to expand our partnership with NVIDIA to build leading-edge clusters using their Vera Rubin platform to deliver personal superintelligence to everyone in the world,” said Mark Zuckerberg, founder and CEO of Meta.

Expanded NVIDIA CPU Deployment for Performance Boost

Meta and NVIDIA are continuing to partner on deploying Arm-based NVIDIA Grace™ CPUs for Meta’s data center production applications, delivering significant performance-per-watt improvements in its data centers as part of Meta’s long-term infrastructure strategy.

The collaboration represents the first large-scale NVIDIA Grace-only deployment, supported by codesign and software optimization investments in CPU ecosystem libraries to improve performance per watt with every generation.

The companies are also collaborating on deploying NVIDIA Vera CPUs, with the potential for large-scale deployment in 2027, further extending Meta’s energy-efficient AI compute footprint and advancing the broader Arm software ecosystem.

Unified Architecture Supports Meta’s AI Infrastructure

Meta will deploy industry-leading NVIDIA GB300-based systems and create a unified architecture that spans on-premises data centers and NVIDIA Cloud Partner deployments to simplify operations while maximizing performance and scalability.

In addition, Meta has adopted the NVIDIA Spectrum-X Ethernet networking platform across its infrastructure footprint to provide AI-scale networking, delivering predictable, low-latency performance while maximizing utilization and improving both operational and power efficiency.

Confidential Computing for WhatsApp

Meta has adopted NVIDIA Confidential Computing for WhatsApp private processing, enabling AI-powered capabilities across the messaging platform while ensuring user data confidentiality and integrity.

NVIDIA and Meta are collaborating to expand NVIDIA Confidential Compute capabilities beyond WhatsApp to emerging use cases across Meta’s portfolio, supporting privacy-enhanced AI at scale.

Codesigning Meta’s Next-Generation AI Models

Engineering teams across NVIDIA and Meta are engaged in deep codesign to optimize and accelerate state-of-the-art AI models across Meta’s core workloads. These efforts combine NVIDIA’s full-stack platform with Meta’s large-scale production workloads to drive higher performance and efficiency for new AI capabilities used by billions around the world.

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Kingston Technology Remains Among Top Private Companies in 2025

Kingston Technology today announced it risen to the #28 spot on Forbes’ list of America’s Top Private Companies for 2025. This recognition marks Kingston’s continued growth in a rapidly evolving landscape. Kingston remains the top “Technology Hardware & Equipment” company on the list, reinforcing its position as an industry leader.

For more than two decades, Kingston has proudly held the title of #1 third-party supplier of DRAM modules worldwide and continues to lead as #1 in SSDs in the channel. These rankings, according to Forbes, reflect Kingston’s ability to consistently deliver high-quality products and maintain strong relationships with partners and customers across the globe. Kingston’s success is due in part to a simple yet powerful philosophy: “Built on Commitment.” This guiding principle has shaped the company’s culture and operations for nearly 40 years. From its humble beginnings in 1987 to becoming a global technology powerhouse, Kingston has remained steadfast in its dedication to quality, reliability, and customer care.

 “This Forbes recognition, along with our ‘Built on Commitment’ philosophy, marks Kingston’s dedication and long-term vision: expand our product offerings, strengthen global partnerships, and continue setting industry benchmarks for performance and reliability,” said Kingston. “None of these achievements happen without the strong foundation and collaborative relationships we’ve built across the industry.”

The full list of America’s Largest Private Companies can be found here.

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Samsung Teams With NVIDIA To Lead the Transformation of Global Intelligent Manufacturing Through New AI Megafactory

Samsung Electronics announced plans to create a new AI Megafactory in collaboration with NVIDIA, marking a major milestone in the company’s efforts to lead the global paradigm shift toward AI-driven manufacturing. By deploying more than 50,000 NVIDIA GPUs, AI will be embedded throughout Samsung’s entire manufacturing flow, accelerating development and production of next-generation semiconductors, mobile devices and robotics.

Samsung’s AI Factory will integrate every aspect of semiconductor manufacturing, from design and process to equipment, operations and quality control, into a single intelligent network, where AI continuously analyzes, predicts and optimizes production environments in real time.

The Samsung AI Factory goes beyond traditional automation, serving as an intelligent manufacturing platform that connects and interprets the immense data generated across chip design, production and equipment operations.

From 25+ Year Collaboration to a Stronger AI Chip Alliance

Samsung and NVIDIA celebrate a collaboration that spans more than 25 years, beginning with Samsung’s DRAM powering NVIDIA’s early graphics cards and extending through foundry partnership.

In addition to their ongoing collaborations, Samsung and NVIDIA are also working together on HBM4. With incredibly high bandwidth and energy efficiency, Samsung’s advanced HBM solutions are expected to help accelerate the development of future AI applications and form a critical foundation for manufacturing infrastructure driven by these technologies.

Built with the company’s 6th-generation 10-nanometer (nm)-class DRAM and a 4nm logic base die, Samsung HBM4’s processing speeds can reach 11 gigabits-per-second (Gbps), far exceeding the JEDEC standard of 8Gbps.

Samsung will also continue to deliver next-generation memory solutions, including HBM, GDDR, and SOCAMM, as well as foundry services, driving innovation and scalability across the global AI value chain.

Accelerating the Transition to Intelligence-Driven Manufacturing

Over the next several years, Samsung plans to implement NVIDIA accelerated computing to scale its AI Factory and accelerate digital twin manufacturing powered by NVIDIA Omniverse libraries across one of the world’s most comprehensive chip manufacturing infrastructures ― spanning memory, logic, foundry and advanced packaging.

Leveraging NVIDIA cuLitho and CUDA-X libraries for its optical proximity correction (OPC) process, Samsung has achieved a 20x gain in computational lithography performance. As a critical step in accurate wafer patterning, the enhanced OPC enables AI to predict and correct circuit pattern variations with far greater speed and precision, reducing development cycles.

For electronic design automation (EDA), the companies are collaborating with EDA partners to develop next-generation GPU-accelerated EDA tools and design technologies.

Using NVIDIA Omniverse libraries, Samsung is building digital twins that can visualize entire fab operations virtually. These virtual environments identify anomalies, perform predictive maintenance and optimize production before changes are applied in the physical world.

Samsung plans to extend its AI Factory infrastructure to its global manufacturing hubs, including Taylor, U.S., bringing greater intelligence and agility to its worldwide semiconductor operations.

Building Out the AI Ecosystem Across Generative AI and Robotics

Samsung has been developing proprietary AI models that power more than 400 million of its devices. These models are also integrated into the company’s internal manufacturing systems, driving intelligence and innovation across its production processes.

Built on NVIDIA accelerated computing and the Megatron framework, Samsung’s AI models demonstrate advanced reasoning capabilities that deliver exceptional performance in real-time translation, multilingual conversations and intelligent summarization.

In intelligent robotics, Samsung is leveraging the NVIDIA RTX PRO™ 6000 Blackwell Server Edition platform to advance manufacturing automation and humanoid robotics, accelerating adoption and enhancing autonomy in next-generation physical AI applications.

Samsung is also working with a range of NVIDIA AI platforms to connect virtual simulation and real-world robot data, enabling robots to understand their surroundings, make decisions and operate intelligently in real-life settings. Using the NVIDIA Jetson Thor robotic platform, Samsung is accelerating real-time AI reasoning, task execution and safety controls in intelligent robots.

Samsung plans to extend the use of these technologies into its AI Factory infrastructure and across its broader business areas, building out an intelligent manufacturing ecosystem that brings together AI and robotics.

Connecting Consumers and Industries Through AI

Samsung is also working with NVIDIA, Korean telecom operators, academia and research institutions to foster collaboration on AI-RAN development.

AI-RAN is a key next-generation communication technology that integrates AI computing power into mobile network capabilities. It allows agentic and physical AI ― such as robots, drones and industrial automation equipment ― to intelligently operate, sense, process data and perform inferences in real-time at the network edge, closer to the points where physical AI connect to the network. This AI-powered mobile network will play a crucial role as a neural network essential in widespread adoption of physical AI.

This new initiative builds upon Samsung and NVIDIA’s collaboration last year, which successfully completed the proof-of-concept of AI-RAN through combining Samsung’s software-based network and NVIDIA GPU. The companies will continue to strengthen their ongoing collaboration on AI-RAN.

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Kingston Technology Remains Top DRAM Module Supplier for 2024

Kingston Technology, a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce. Kingston retains its number 1 position with an estimated 66% market share. TrendForce states DRAM module sales rose 7% YoY in 2024, reversing the 28% decline seen in 2023. Kingston maintained a strong market share, though its revenue growth slowed due to weaker consumer demand in the second half of 2024.

According to the report, the world’s top five memory module houses accounted for 81% of total sales in 2024, with the top eight accounting for 83%. The results reinforced Kingston’s dominance as the clear leader in DRAM module production, as the second-place supplier accounted for only 5 percent of the total market share. At the end of Q4 2023, DRAM suppliers began prioritizing high bandwidth memory and server-grade DDR5 products. This strategic shift resulted in tighter availability of other DRAM types, driving up demand and pushing overall prices higher. In response, module manufacturers increased procurement and replenished inventory, contributing to a total market revenue of $13.3 billion in 2024. However, in the latter half of the year, rising module prices began to suppress demand, ultimately limiting sales growth.

In 2024, Kingston released a limited edition racecar inspired version for the Kingston FURY Renegade line. The Kingston FURY Renegade DDR5 RGB Limited Edition featured a striking new curved design reminiscent of modern racecars and leveraged the latest technology to achieve an aggressive speed of 8000MT/s, that fueled extreme overclocking potential while minimizing performance bottlenecks.

In addition, Kingston released the Kingston FURY Renegade DDR5 CUDIMMs, compatible with Intel’s new 800-series chipset (formerly codenamed Arrow Lake). The introduction of overclockable DDR5 CUDIMM modules allows broader reach of professionals who demand top-tier performance and want to push the limits of their systems without compromising signal integrity.

“The 2024 findings from TrendForce reflect the company’s ongoing strength and adaptability in the face of yet another demanding business year.” said Kingston. “This milestone not only reaffirms Kingston’s dominant presence in the market but also underscores the company’s resilience and significance within the industry, as we now proudly maintain our top position for the 22nd consecutive year.”

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Samsung and OpenAI Announce Strategic Partnership To Accelerate Advancements in Global AI Infrastructure

OpenAI, Samsung Electronics, Samsung SDS, Samsung C&T and Samsung Heavy Industries today announced a letter of intent (LOI) for their strategic partnership to accelerate advancements in global AI data center infrastructure and develop future technologies together in relevant fields. This expansive collaboration will bring together the collective strengths and leadership of Samsung companies across semiconductors, data centers, shipbuilding, cloud services and maritime technologies.

The signing ceremony was held at Samsung’s corporate headquarters in Seoul, Korea, attended by Young Hyun Jun, Vice Chairman & CEO of Samsung Electronics; Sung-an Choi, Vice Chairman & CEO of Samsung Heavy Industries; Sechul Oh, President & CEO of Samsung C&T; and Junehee Lee, President & CEO of Samsung SDS.

Samsung Electronics

Samsung Electronics will work with OpenAI as a strategic memory partner to supply advanced semiconductor solutions for OpenAI’s global Stargate initiative. With OpenAI’s memory demand projected to reach up to 900,000 DRAM wafers per month, Samsung will contribute toward meeting this need with its extensive lineup of high-performance, energy-efficient DRAM solutions.

As a comprehensive semiconductor solutions provider, Samsung’s leading technologies span across memory, logic and foundry with a diverse product portfolio that supports the full AI workflow from training to inference.

The company also brings differentiated capabilities in advanced chip packaging and heterogeneous integration between memory and system semiconductors, enabling it to provide unique solutions for OpenAI.

Samsung SDS

Samsung SDS has entered into a potential partnership with OpenAI to jointly develop AI data centers and provide enterprise AI services.

Leveraging its expertise in advanced data center technologies, Samsung SDS will collaborate with OpenAI in the design, development and operation of the Stargate AI data centers. Under the LOI, Samsung SDS can now provide consulting, deployment and management services for businesses seeking to integrate OpenAI’s AI models into their internal systems.

In addition, Samsung SDS has signed a reseller partnership for OpenAI’s services in Korea and plans to support local companies in adopting OpenAI’s ChatGPT Enterprise offerings.

Samsung C&T and Samsung Heavy Industries

Samsung C&T and Samsung Heavy Industries will collaborate with OpenAI to advance global AI data centers, with a particular focus on the joint development of floating data centers.

Floating data centers are considered to have advantages over data centers because they can address land scarcity, lower cooling costs and reduce carbon emissions. Still, their technical complexity has so far limited wider deployment.

Building on their proprietary technologies, Samsung C&T and Samsung Heavy Industries will also explore opportunities to pursue projects in floating power plants and control centers, in addition to floating data center infrastructure.

Starting with the landmark partnership with OpenAI, Samsung plans to fully support Korea’s goals to become one of the world’s top three nations in AI and create new opportunities in the field.

Samsung is also exploring broader adoption of ChatGPT within the companies to facilitate AI transformation in the workplace.

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BIWIN Received the Recognization as the “Most Valuable SSE STAR Market Listed Company"

BIWIN, a leading provider of advanced memory and storage solutions, has been recognized as the “Most Valuable SSE STAR Market Listed Company.” This distinction underscores BIWIN’s reputation as a trusted innovator in China’s technology sector and capital markets. From prestigious industry awards to record-breaking financial performance, BIWIN continues to expand its global presence, delivering next-generation storage solutions to customers worldwide.

Innovation as a Growth Engine

Since its debut on the SSE STAR Market in 2022, BIWIN has established a full-chain capability spanning chip design, memory solutions, advanced packaging and testing, and test equipment development. This integrated model enables the company to serve diverse industries—including consumer electronics, AI edge devices, automotive systems, and enterprise storage—with speed, scalability, and reliability.

Key technological milestones include the mass production of 16-layer stacked die and 30–40μm ultra-thin die packaging, which support ultra-thin, high-capacity storage widely adopted in smartphones and wearables. In addition, BIWIN’s self-developed test platforms integrate ATE, burn-in, and SLT processes, enhancing product stability and yields across a broad range of applications.

Sustained Business Momentum

BIWIN’s strong performance reflects both market demand and its commitment to R&D investment.
• In 2024, the company achieved revenue of approximately $920 million (USD), marking an 86% year-on-year increase, while net profit surged by 125.8%.
• Revenue from AI edge devices surpassed $137 million (USD), growing 294% year-on-year, driven by smartwatches, AI glasses, and learning devices.
• In the first half of 2025, revenue reached $539 million (USD), up 13.7% year-on-year, with profitability and margins improving steadily.
These results position BIWIN among the fastest-growing players in the global memory and storage industry.

How BIWIN’s Technology Powers Industries Worldwide

BIWIN’s innovations are enabling the digital transformation of key sectors:
• Smart Living & Consumer Experiences: Powering slimmer and smarter wearables, AI-driven glasses, and interactive learning devices that make digital lifestyles more intuitive.
• AI at the Edge: Delivering high-capacity, low-latency storage that brings real-time processing to intelligent terminals, from next-gen mobile devices to AI-powered assistants.
• Intelligent Mobility: Enabling automotive-grade memory that meets the demands of autonomous driving, with high endurance and safety at its core.
• Data-Driven Enterprises: Supporting data centers and cloud infrastructure with solutions designed for scalability, reliability, and energy efficiency.
• Innovation in Manufacturing: Leveraging wafer-level advanced packaging and proprietary in-house testing systems to deliver high yields, stable performance, and rapid scale-up for high-demand industries.

With an investment of approximately $260 million (USD) investment in expanded packaging and testing capacity, BIWIN is building the foundation for long-term growth. This strategic expansion allows the company to address surging demand across AI, automotive, enterprise, and consumer markets, while reinforcing its position as a trusted partner in the global memory ecosystem.

Expanding Global Presence with Cutting-Edge Storage Solutions

In May 2024, BIWIN unveiled a new logo, symbolizing its transformation from a storage solutions provider into a global technology powerhouse. The refreshed identity reflects BIWIN’s commitment to innovation, global expansion, and engineering excellence.

BIWIN Corporate Logo

Earlier in 2024, the company launched Biwin, its consumer brand, offering SSDs, DRAM, portable SSDs, memory cards, and card readers. With a focus on performance and reliability, Biwin brings cutting-edge storage technology to consumers worldwide, from work and study to gaming and entertainment. Learn more at www.biwintech.com. 

Looking Ahead: A Global Vision

BIWIN is advancing its “R&D-Packaging-Testing Integration 2.0” strategy to expand industrial coverage, strengthen technology barriers, and raise product value for customers. The company is actively pursuing global collaboration and local partnerships, fostering a stronger storage ecosystem and supporting clients across both mature and emerging markets. For more information, please visit www.biwintechnology.com. 

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A10 Networks Demonstrates Capabilities for the Security, Resilience and Performance of AI Infrastructure

Organizations across the globe are rapidly deploying new AI applications and building new AI-ready data centers to automate and achieve operational excellence in their organizations. This requires ultra-high performance for AI and large language model (LLM) inference environments to deliver real-time response, as well as new cybersecurity solutions to secure them.

Preventing, Detecting and Mitigating AI and LLM-level Cyber Threats

A10 is announcing new AI firewall capabilities that can be deployed in front of APIs or URLs that expose large language models – either as a custom LLM or developed on top of a commercial solution like OpenAI or Anthropic. Built on edge-optimized architecture with GPU-enabled hardware, these capabilities protect AI LLMs at high performance and can be deployed in any infrastructure as an incremental security capability.

These capabilities can help prevent, detect and mitigate AI-level threats by enabling customers to test their AI inference models against known vulnerabilities and to help remove them using A10’s proprietary LLM safeguarding techniques. The capability detects AI-level threats like prompt injections and sensitive information disclosure by inspecting request and response traffic at the prompt level and enforcing security policies required for mitigating these threats.

Delivering Real-time Experience for AI and LLM Inference Environments

A10 continues to deliver high performance and resilience for AI and LLM-enabled applications. This is done by offloading processor-intensive tasks like TLS/SSL decryption, caching, optimizing traffic routing and by providing actionable insights to maximize network availability and performance. New capabilities allow early detection of network performance issues, much like an early warning system. This helps identify near-term congestion or capacity deficiencies, helping customers to take proactive action before an issue becomes critical. The capabilities help prevent unscheduled downtime and plan for optimal network performance. Predictive performance will run on A10 appliances that are powered by GPUs, allowing faster processing speed with the ability to quickly analyze vast amounts of data and provide insights into anomalies ahead of time.

Together, these AI security and infrastructure capabilities allow for ease of management, broader intelligence to accurately detect threats, and help deliver an optimal customer experience. “Enterprises are deploying and training AI and LLM inference models on-premises or in the cloud at a rapid pace. New apabilities must be developed to address three key challenges of these new environments: latency, ecurity and operational complexity. With over 20 years of experience in securing and delivering applications, we are expanding our capabilities to deliver on these needs to provide resilience, high performance and security for AI and LLM infrastructures,” said Dhrupad Trivedi, president and CEO, A10 Networks.

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Kingston Fuels the Future: Showcasing High-Performance AI Solutions at COMPUTEX 2025

Kingston Technology, a world leader in memory products and technology solutions, returns to COMPUTEX 2025 with the theme “Kingston Powers Tomorrow: Committed to the AI Future.” Staying true to its Built on Commitment promise, Kingston unveils its Kingston Future City showroom, spotlighting innovation across speed, intelligence, and imagination. From AI servers to aerospace, the exhibit brings real-world use cases of Kingston’s memory and storage solutions to life. Featured highlights include the newly launched Kingston FURY™ Renegade G5 SSD, enterprise-grade DC3000ME SSD, and compact solutions like the DataTraveler® Exodia™ S USB. As AI continues to transform industries, Kingston supports this shift with solutions rooted in quality, performance, and an enduring commitment to innovation.

“At Kingston, we don’t just anticipate the future, we help build it,” says Kevin Wu, Vice President of Sales/Marketing and Business Development Vice President, APAC. “From powering AI servers to supporting aerospace innovations, Kingston’s memory and storage solutions are enabling the breakthroughs of tomorrow. Built on Commitment is the foundation of everything we do, and at COMPUTEX 2025, we’re proud to showcase how that promise continues to push the boundaries of innovation.”

Kingston Future City is an immersive tech experience that brings the company’s vision of an AI-powered world to life. Divided into three zones, the exhibit showcases how Kingston’s innovations are shaping tomorrow’s technologies.

Kingston Intelligence Hub

At the heart of Kingston Future City, the Kingston Intelligence Hub highlights how Kingston’s enterprise memory and storage solutions power the rapid evolution of AI and robotics. This zone features the newly launched DC3000ME PCIe 5.0 NVMe U.2 SSD and Server Premier DDR5 Memory, supercharging a GIGABYTE AI server rack. Engineered for exceptional speed, endurance, and reliability, these solutions are built to meet the rigorous demands of AI workloads. 

Kingston's AI-ready solutions support robots, AI PCs, and AI servers, delivering tangible benefits in public safety, data security, and production line efficiency. Exemplifying Kingston's Built on Commitment philosophy, they provide reliable, end-to-end infrastructure for next-generation AI applications. To illustrate real-world implementation, Kingston partners with Taiwan Intelligent Robotics Company, Ltd. (TIRC) to showcase its Multi-modal Inspection Robot Solution. Deployed in challenging environments such as factories and remote field sites, these robots collect and transmit large volumes of data and image for real-time AI analysis. Powered by Kingston's DC3000ME SSD and Server Premier DDR5 Memory in AI servers, along with Kingston FURY Renegade DDR5 Memory and Kingston FURY Renegade G5 SSD in AI PCs, the system enables rapid detection and response to safety hazards, security breaches, and anomalies. With dependable performance at every stage of the data journey, Kingston plays a pivotal role in advancing smarter, faster, and more responsive AI systems across industries.

FURY Acceleration Center

As the power engine of Kingston Future City, the FURY Acceleration Center is fueled by Kingston FURY Memory and SSDs, delivering ultra-fast performance for demanding workloads and next-gen gaming. This zone showcases the newly launched Kingston FURY Renegade G5 PCIe 5.0 NVMe M.2 SSD, one of the world’s fastest client SSDs, in action with a high-performance ASUS PC build. Also on display are the Kingston FURY Renegade DDR5 CUDIMM at an enhanced overclocked speed of 8,800MT/s, and the compact Kingston FURY Impact DDR5 CAMM2, shown in expanded capacities for PC build, notebook and mobile workstation users. 

Innovative Creators Lab

As the creative hub of Kingston Future City, this space underscores Kingston’s expanding role in advanced technologies. Kingston’s solutions have previously participated in aerospace and satellite communications, facilitating ground-to-air data transmission. This year, Kingston partners with the Rocket Technology Exploration Team (RTET), a student team from NTUST and NFU in East Asia, to demonstrate its solutions in real-world aerospace applications. On-site, a functioning rocket powered with PCIe Gen5 speed of Kingston FURY Renegade G5 SSD is displayed, featuring a custom-developed avionics system that captures and transmits flight data in real-time. Meanwhile, Kingston FURY Renegade DDR5 memory and Gen5 SSD are installed in a high-performance MSI PC to handle real-time mission data processing and analysis on the ground. 

The Creators Lab also spotlights Kingston’s solutions for creators and tech enthusiasts. New designs for the XS1000 and XS2000 External SSDs debut at COMPUTEX 2025, alongside the newly launched Kingston DataTraveler Exodia S USB flash drive, and updated Canvas Plus series SD and microSD cards, now with faster speeds. From aerospace exploration to creative production, this space highlights the innovation and engineering strength of emerging talent, while reinforcing Kingston’s commitment to delivering high-performance solutions across the most demanding technology fields.

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