Xiaomi has expanded its premium mobile portfolio with the introduction of the Xiaomi 18 Fold and the large-screen Xiaomi Pad 9 Pro Max, targeting mobile professionals who demand desktop-grade versatility on the move. Built to resolve the bulk traditionally associated with book-style foldables, the Xiaomi 18 Fold collapses down to the footprint of a standard passport while opening into a continuous 7.58-inch workspace for frictionless split-screen multitasking. Together with the Pad 9 Pro Max—engineered as a high-performance canvas for creative and business workflows—Xiaomi’s dual-flagship rollout establishes an integrated hardware ecosystem tailored for productivity across work, content creation, and entertainment.
New Form Factor: From Single-Hand Fit to Full-Screen Views
Adopting the same √2:1 aspect ratio as standard A4 paper, Xiaomi 18 Fold achieves a higher screen utilization rate for a range of content, from 16:9 video and 4:3 photos to documents and more. With both the inner and outer displays sharing the same aspect ratio, transitioning from one screen to the next feels more natural, creating a truly seamless user experience.
When folded, Xiaomi 18 Fold measures 117.8 × 83.6mm, with a thickness of 10.68mm. At 219g, the phone is lighter than all previous Xiaomi foldable smartphones. Super-elliptical large R corners and a flat-edge frame give the phone a smooth in-hand feel and appearance, while the compact 5.38-inch outer display makes it easy to perform inputs like pull-down, typing, or back gestures with just one hand.
When unfolded, Xiaomi 18 Fold opens up to an expansive 7.58-inch main screen in a slim 5.02mm body. Optimized especially for Xiaomi 18 Fold, Xiaomi HyperOS delivers a seamless multi-window experience — with two-way split providing two well-proportioned viewing areas, while three-way split gives each section a layout close to that of mainstream full-screen smartphones.
Folding Architecture: Engineered for Greater Reliability
Xiaomi 18 Fold is built for longevity with high-strength materials across all critical components, including a high-strength 7000-series aluminum alloy frame and Xiaomi Shield Glass 3.0 on both the outer display and back panel. The cover glass is further strengthened through ion implantation for improved drop resistance, and the new-generation Xiaomi proprietary hinge features a patented three-link design that wraps around the screen to provide added protection while creating more space for the display.
Xiaomi 18 Fold debuts a dual-layer Ultra Thin Glass (UTG) structure, combining a 50μm upper UTG layer with an additional 30μm UTG support layer for enhanced inner display protection. At the same time, Xiaomi replaces the previous inorganic insulating material in the touch layer with a more stretchable organic film, further improving impact resistance. Together with reinforced hinge-area construction, these upgrades make Xiaomi 18 Fold Xiaomi's most reliable foldable smartphone to date, with 258% higher inner display impact resistance and support for drops from up to 1.2m. The optimized display stack also delivers a flatter inner display, with an average crease depth of no more than 30μm.
Xiaomi XRING O3: Flagship AI SoC Unleashes Next-Gen Power
Xiaomi 18 Fold is the first Xiaomi flagship powered by Xiaomi XRING O3, Xiaomi's second SoC designed entirely in-house. Built on a 3nm process, the chip packs 24 billion transistors—up from 19 billion on the previous generation—and combines a 10-core all-big-core CPU with a 16-core GPU. It also introduces architectural-level optimizations to CPU memory latency, speeding up data exchange for higher overall performance with lower power consumption
Making up the 10 cores in the CPU are two Ultra cores, four Premium cores, and four Pro cores. Working together, they handle a full range of tasks while delivering 60% higher performance and 25% lower power consumption than the previous generation.
For graphics, XRING O3 is equipped with the all-new G2-Ultra NX GPU featuring a massive 16-core configuration. Boosting graphics performance by 85% and reducing power consumption by 64% compared to its predecessor, the new G2-Ultra NX sets a new standard for graphics performance on a smartphone.
XRING O3 is also the first SoC to support the latest LPDDR6 RAM. Featuring data rates of up to 10,667 Mbps and a 24-bit interface width — up from 16-bit on LPDDR5X — the new RAM achieves a total memory bandwidth of 113.8 GB/s, marking an almost 50% increase over LPDDR5X-9600.
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