Xiaomi Enters Mid-Size Foldable Arena with 219g Xiaomi 18 Fold and Pad 9 Pro Max

Xiaomi has expanded its premium mobile portfolio with the introduction of the Xiaomi 18 Fold and the large-screen Xiaomi Pad 9 Pro Max, targeting mobile professionals who demand desktop-grade versatility on the move. Built to resolve the bulk traditionally associated with book-style foldables, the Xiaomi 18 Fold collapses down to the footprint of a standard passport while opening into a continuous 7.58-inch workspace for frictionless split-screen multitasking. Together with the Pad 9 Pro Max—engineered as a high-performance canvas for creative and business workflows—Xiaomi’s dual-flagship rollout establishes an integrated hardware ecosystem tailored for productivity across work, content creation, and entertainment.

New Form Factor: From Single-Hand Fit to Full-Screen Views

Adopting the same √2:1 aspect ratio as standard A4 paper, Xiaomi 18 Fold achieves a higher screen utilization rate for a range of content, from 16:9 video and 4:3 photos to documents and more. With both the inner and outer displays sharing the same aspect ratio, transitioning from one screen to the next feels more natural, creating a truly seamless user experience.

When folded, Xiaomi 18 Fold measures 117.8 × 83.6mm, with a thickness of 10.68mm. At 219g, the phone is lighter than all previous Xiaomi foldable smartphones. Super-elliptical large R corners and a flat-edge frame give the phone a smooth in-hand feel and appearance, while the compact 5.38-inch outer display makes it easy to perform inputs like pull-down, typing, or back gestures with just one hand.

When unfolded, Xiaomi 18 Fold opens up to an expansive 7.58-inch main screen in a slim 5.02mm body. Optimized especially for Xiaomi 18 Fold, Xiaomi HyperOS delivers a seamless multi-window experience — with two-way split providing two well-proportioned viewing areas, while three-way split gives each section a layout close to that of mainstream full-screen smartphones.

Folding Architecture: Engineered for Greater Reliability

Xiaomi 18 Fold is built for longevity with high-strength materials across all critical components, including a high-strength 7000-series aluminum alloy frame and Xiaomi Shield Glass 3.0 on both the outer display and back panel. The cover glass is further strengthened through ion implantation for improved drop resistance, and the new-generation Xiaomi proprietary hinge features a patented three-link design that wraps around the screen to provide added protection while creating more space for the display.

Xiaomi 18 Fold debuts a dual-layer Ultra Thin Glass (UTG) structure, combining a 50μm upper UTG layer with an additional 30μm UTG support layer for enhanced inner display protection. At the same time, Xiaomi replaces the previous inorganic insulating material in the touch layer with a more stretchable organic film, further improving impact resistance. Together with reinforced hinge-area construction, these upgrades make Xiaomi 18 Fold Xiaomi's most reliable foldable smartphone to date, with 258% higher inner display impact resistance and support for drops from up to 1.2m. The optimized display stack also delivers a flatter inner display, with an average crease depth of no more than 30μm.

Xiaomi XRING O3: Flagship AI SoC Unleashes Next-Gen Power

Xiaomi 18 Fold is the first Xiaomi flagship powered by Xiaomi XRING O3, Xiaomi's second SoC designed entirely in-house. Built on a 3nm process, the chip packs 24 billion transistors—up from 19 billion on the previous generation—and combines a 10-core all-big-core CPU with a 16-core GPU. It also introduces architectural-level optimizations to CPU memory latency, speeding up data exchange for higher overall performance with lower power consumption

Making up the 10 cores in the CPU are two Ultra cores, four Premium cores, and four Pro cores. Working together, they handle a full range of tasks while delivering 60% higher performance and 25% lower power consumption than the previous generation.

For graphics, XRING O3 is equipped with the all-new G2-Ultra NX GPU featuring a massive 16-core configuration. Boosting graphics performance by 85% and reducing power consumption by 64% compared to its predecessor, the new G2-Ultra NX sets a new standard for graphics performance on a smartphone.

XRING O3 is also the first SoC to support the latest LPDDR6 RAM. Featuring data rates of up to 10,667 Mbps and a 24-bit interface width — up from 16-bit on LPDDR5X — the new RAM achieves a total memory bandwidth of 113.8 GB/s, marking an almost 50% increase over LPDDR5X-9600.

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Surging Memory Demand Propels Kingston to Top DRAM Supplier Spot Amid 59% Market Surge

Rapid enterprise DDR5 transitions and high-density computing demands have propelled global third-party DRAM module revenues to $21.2 billion, with Kingston Technology retaining its uncontested position as the industry’s leading supplier. As reported by TrendForce, industry-wide revenues accelerated by 59% year-on-year in 2025—a sharp contrast to the 7% growth recorded in 2024—fueled by tight wafer allocations and rising contract pricing in the second half of the year. Leveraging its strategic procurement scale and broad commercial portfolio to navigate shifting server and workstation architectures, Kingston achieved 48% annual revenue growth, capturing an estimated 62% market share as enterprises scale their memory footprints.

The DRAM market experienced a dramatic shift during 2025. Early in the year, DRAM module manufacturers increased DDR4 inventory levels in response to tariff concerns and DRAM suppliers' end-of-life plans for DDR4 products. Later in the year, growing demand from cloud service providers supporting agentic AI workloads significantly increased server DRAM consumption. This surge reduced DRAM allocations available for PC and consumer applications, contributing to higher memory prices and stronger module market performance. The shift made clear that enterprise, data center, and AI infrastructure have become the primary forces shaping memory demand, and these are the segments where Kingston has been steadily expanding its B2B business.

Kingston's industry-leading procurement scale allowed the company to strategically manage inventory throughout 2025 and, as DRAM pricing strengthened during the second half of the year, Kingston was well positioned to aggressively support channel demand, helping drive its strong annual performance. TrendForce also noted that DRAM module manufacturers increasingly focused on industrial and enterprise server markets during 2025 while accelerating the transition to DDR5-based product portfolios. Beyond the channel, Kingston's B2B business delivered strong growth in 2025 as enterprise, data center, and industrial customers increasingly turned to Kingston for supply continuity, validated solutions, and long-term support.

Building on decades of experience in enterprise and industrial deployments, Kingston's portfolio spans DDR4 to DDR5 solutions designed for business-critical environments, supporting applications ranging from client PCs and gaming systems to servers, data centers, AI infrastructure, and industrial, embedded, surveillance, and automation systems. This breadth enables customers to navigate evolving technology requirements and scale confidently into next-generation computing workloads.

"Maintaining our leadership position in a dynamic and rapidly evolving memory market reflects Kingston's long-term strategy, strong supplier relationships, and commitment to serving customers worldwide," said Kingston. "Our ability to anticipate market transitions, manage inventory effectively, and provide reliable memory solutions enabled us to support partners and customers throughout the year. At the same time, Kingston's B2B business has become a key growth engine, as enterprise, data center, and industrial customers increasingly rely on Kingston for supply continuity, validated solutions, and long-term support. With memory solutions spanning every major DRAM application, from client PCs and gaming systems to servers, data centers, and AI infrastructure, we are well positioned to help customers scale and innovate wherever their workloads take them.”

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KLEVV Pairs High-Speed Gen4 Performance with Advanced Thermal Designs Across New CRAS SSD Range

Addressing the critical relationship between sustained NVMe performance and thermal dissipation, KLEVV has highlighted its latest PCIe Gen4 SSD family: the CRAS C930, C925G, and C910G. To combat thermal throttling under heavy read/write cycles, the drives feature purpose-built cooling solutions ranging from finned aluminum heatsinks on the flagship C930 to ultra-slim graphene-copper composite heat spreaders on the C925G and C910G. These specialized cooling profiles allow PC builders and system integrators to achieve sustained high-throughput data transfers in space-constrained enclosures without sacrificing component longevity or device stability.

KLEVV CRAS C930 SSD: Flagship PCIe Gen4 Performance & DRAM Cache

Designed for users who demand high-performance storage, the CRAS C930 combines PCIe Gen4 x4 connectivity with the NVMe 1.4 interface to deliver sequential read speeds of up to 7,400 MB/s and sequential write speeds of up to 6,800 MB/s, alongside random read and write performance of up to 1,000K IOPS. Performance figures are based on the 2TB model, with actual performance varying depending on the system configuration and workload.

The CRAS C930 is equipped with a DRAM cache buffer that acts as a high-speed buffer between the NAND flash and controller, helping enhance read and write performance while contributing to overall drive durability. It also features intelligent SLC caching, S.M.A.R.T. monitoring, LDPC ECC, global wear leveling, and AES 256-bit hardware-based encryption for enhanced reliability, data protection, and long-term stability.

For thermal management, the CRAS C930 comes with an optional attachable flat-fin aluminum heatsink that users can install according to their system and cooling requirements. With the heatsink installed, the CRAS C930 can achieve up to 20% temperature reduction compared with an SSD without a heatsink, helping maintain stable performance during demanding workloads.

Available in 1TB and 2TB capacities, the CRAS C930 is also designed to be compatible with the PlayStation 5 expansion slot, giving gamers additional storage capacity while maintaining high-speed performance for their game libraries.

KLEVV CRAS C925G SSD: High-Speed Performance & Precision Cooling

Combining high-speed PCIe Gen4 performance with an ultra-slim thermal solution, the CRAS C925G is designed for gamers and content creators seeking fast storage without compromising system compatibility. It delivers sequential read speeds of up to 7,400 MB/s and sequential write speeds of up to 6,500 MB/s, while random read and write performance reaches up to 700K and 1,000K IOPS respectively on the 2TB model.

The CRAS C925G features a graphene-copper composite heatsink designed to efficiently dissipate heat from the SSD during demanding workloads. Its slim heatsink design helps manage operating temperatures while maintaining compatibility with a wide range of systems, making it suitable for desktop PCs, laptops, and gaming setups where clearance can be a concern.

Available in 500GB, 1TB and 2TB capacities, the CRAS C925G offers sequential write speeds of up to 6,200 MB/s, 6,300 MB/s and 6,500 MB/s respectively. The drive also provides endurance ratings of up to 600TBW, 1,200TBW and 2,400TBW depending on capacity.

With its combination of high-speed PCIe Gen4 performance, efficient thermal management and compact design, the CRAS C925G provides a versatile storage solution for users looking to accelerate gaming, productivity and content creation workloads.

KLEVV CRAS C910G SSD: High Capacity & Efficient Thermal Management

Built for users who prioritize storage capacity while still benefiting from PCIe Gen4 performance, the CRAS C910G offers a balanced solution for gaming, productivity, content creation and everyday computing. Its PCIe Gen4 x4 interface provides sequential read speeds of up to 5,200 MB/s and sequential write speeds of up to 4,800 MB/s, while random read and write performance reaches up to 540K and 600K IOPS respectively, depending on capacity.

The CRAS C910G is equipped with a graphene-copper composite heatsink that provides efficient thermal dissipation in a slim form factor. This allows the SSD to maintain stable performance during demanding workloads while offering greater flexibility for systems with limited internal clearance.

Available in capacities ranging from 500GB up to 4TB, the CRAS C910G provides users with ample flexibility when building or upgrading their storage setup. The 4TB model offers up to 2,800TBW endurance, making it well suited for users who regularly work with large game libraries, high-resolution media files and other storage-intensive workloads.

With its high-capacity options, efficient cooling design and PCIe Gen4 performance, the CRAS C910G is designed to provide dependable high-speed storage for users who need more room for their games, applications and files.

Reliable Performance & Long-Term Storage Confidence

The CRAS C930, CRAS C925G and CRAS C910G are designed with a range of technologies focused on performance, reliability and data protection. Depending on the model, features such as intelligent SLC caching, S.M.A.R.T. monitoring, LDPC ECC and global wear leveling help maintain stable operation while supporting long-term endurance.

KLEVV SSD users can also access Acronis True Image for data migration and backup, allowing users to create full disk images, restore backups and transfer the contents of an existing drive to a new KLEVV SSD.

With three distinct PCIe Gen4 SSD solutions, the CRAS C930, CRAS C925G and CRAS C910G give users the flexibility to choose the right combination of performance, thermal management and storage capacity for their systems.

Product Availability

The KLEVV CRAS C930, CRAS C925G and CRAS C910G PCIe Gen4 SSDs are available through authorized distributors and retail channels worldwide, with availability varying by region and market.

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UGREEN Debuts MagFlow and Nexode Pro Series to Supercharge Next-Gen Apple Setups

Arriving alongside Apple’s latest hardware generation, charging technology specialist UGREEN has launched its new MagFlow and Nexode Pro accessory lineups engineered specifically for Apple users. Tailored for dynamic multi-device workflows, the release pairs fast magnetic wireless charging for on-the-go mobility with high-wattage desktop power delivery. From snap-and-go Qi2-compatible power banks and foldable stands to compact desktop hubs, UGREEN's new lineups provide iPhone, iPad, and MacBook users with a unified charging ecosystem that delivers maximum power without the clutter. 

All-Day Power That Keeps Its Cool

To address the overheating issue common to fast wireless charging products, the MagFlow series brings its answer: the MagFlow Pro Magnetic Power Bank 10000mAh 25W. Its CryoPulse™ liquid-cooling system — visible through a coolant window — reduces heat buildup during charging, keeping the phone up to 10°C cooler. Qi2 25W magnetic charging brings an iPhone 18 Pro Max to around 40% in 30 mins, and the slim 10,000mAh body delivers up to 1.28 charges for the iPhone 18 Pro Max.

Fold It Up and Go

The MagFlow 2-in-1 Foldable Magnetic Wireless Charger 25W folds flat into a pocket-size pad and unfolds into a dual charging station for phone and earbuds: The iPhone snaps onto the magnetic pad and AirPods simply drop onto the wider anti-slip pad below, no fiddly alignment needed. Propped upright, it doubles as a stand for StandBy mode. Compatible with the iPhone 18 series, it delivers Qi2 25W magnetic fast charging wherever the day goes.

World's First 160W Smart Display Charger with Pull-Out Power

At the desk, the Nexode Pro 160W Charger with Retractable Cable — the world's first 160W smart display charger with pull-out power — keeps a laptop, tablet, phone, and camera running at once. Its built-in 70cm USB-C cable pulls out when needed and retracts in seconds, keeping cords neatly tucked away. Through the UgreenConnect, charging modes, charging status and wallpapers can even be adjusted remotely — handy when something has been left plugged in at home.

With new Apple devices now underway, the MagFlow and Nexode Pro series arrive as its charging companions, and go on sale today on Shopee, Lazada and TikTok, with more picks on the Apple season page of UGREEN's official website.

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Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture

Cadence today announced that its Tensilica IP Group and Analog Devices, Inc. (ADI) worked together to develop the latest generation of SHARC® automotive audio processors, further strengthening ADI’s industry-leading position in premium in-vehicle audio solutions. The joint effort brings Cadence’s highly optimized Tensilica DSP architecture into the next-generation ADSP product family from ADI, enabling richer audio experiences, enhanced voice interactions, and greater system intelligence for future automotive platforms.

For decades, ADI has been a leader in automotive audio processing, with its ADSP family powering many of the world's most advanced infotainment and premium audio systems. These processors enable a broad range of applications, including:

• Automated Driving alerts and Acoustic Vehicle Alerting Systems (AVAS)
• Road Noise and Engine Order Cancellation (RNC and EOC)
• Personal Sound Zones (PSZ) and immersive 3D audio rendering
• Voice processing, AI assistance, and hands-free communication

“As the complexity of automotive audio, acoustic and voice applications continues to grow, it became clear that we needed a DSP architecture capable of delivering significantly higher performance and on-chip AI capability while maintaining the deterministic real-time behavior our customers depend on,” said Andrew Lanfear, head of Automotive Audio & Networking, ADI. “Given their leadership in DSP IP, working with Cadence was the natural choice for ADI. The ability to create custom instructions using Tensilica Instruction Extension (TIE) technology allows us to accelerate proprietary audio and voice algorithms while providing dedicated DSP resources for real-time voice offload and next-generation automotive workloads.”

“ADI’s selection of Cadence’s Tensilica DSP technology for the next generation of ADSP processors underscores its focus on high-performance automotive audio and AI,” said Amol Borkar, group director, product management, Tensilica DSPs, Cadence. “The advanced architecture in the SHARC-FX core is optimized for on-chip AI/ML and signal-processing workloads, enabling applications such as music genre identification, music source separation (MSS), and real-time vocal removal to run efficiently on the DSP, while the host CPU remains dedicated to vehicle-domain and operating system functions.”

“DSP Concepts has been a long-time trusted partner of both Cadence Tensilica DSPs and ADI, enabling rich audio applications on both platforms,” said Chin Beckmann, CEO of DSP Concepts. “Through the integration of their technologies in our Audio Weaver (AWE) framework, we were able to witness and validate the winning, best-in-class results of this amazing collaboration between these industry pioneers.”

Building on the success of the ADSP-SC59x/2159x family, ADI is introducing the new ADSP-SC84x/2184x platform, featuring a next-generation architecture and a transition from 28nm to 16nm process technology, delivering significantly improved energy efficiency, higher operating frequencies, and increased integration for modern software-defined vehicles (SDV). Other benefits include an LPDDR4 memory interface, increased on-chip L2 memory, enhanced cybersecurity via a dedicated hardware security module (HSM), and two optional connectivity cores offering enhanced communication and mainline Linux support.

One of the ADSP-SC84x family’s key innovations is the introduction of the new SHARC-FX processor core, designed and built through a joint engagement with Cadence. The SHARC-FX features a custom DSP architecture, built on the same technology platform that delivers best-in-class Tensilica DSPs for audio, vision, and radar segments. As a result, the SHARC-FX delivers a substantial performance uplift, supporting a broader range of data types, enhanced VLIW SIMD architecture, efficient cache operations, and an expanded instruction set optimized for modern signal processing and AI workloads. Together, these improvements, coupled with the higher operating frequency of the SHARC-FX processor core, provide 5X higher performance compared to the previous generation SHARC+ processor used in the ADSP-SC59x family. This paves the way for an array of next-generation applications in the vehicle, including seat-specific in-cabin audio experiences, AI-enhanced noise cancellation, intelligent voice assistants, and generative AI audio.

As automotive audio and voice-enabled systems continue to evolve, many workloads are now transitioning from traditional signal-processing algorithms to AI-driven approaches that deliver higher accuracy, greater adaptability, and more personalized user experiences. The SHARC-FX core’s expanded instruction set enables it to efficiently implement these emerging AI models alongside conventional DSP workloads, providing the computational performance required for real-time neural-network-based audio inference at the edge. By supporting optimized NN kernel routines for popular AI/ML frameworks such as Google’s LiteRT™, the latest AI models can be easily offloaded to the SHARC-FX core for a high performance and energy-efficient implementation compared to running them on the host CPU.

Furthermore, ADI provides a rich toolset and ecosystem consisting of Cadence’s compiler and tools as well as ADI’s EZ-KIT® evaluation system, CrossCore® Embedded Studio, SigmaStudio+TM, and other industry-leading frameworks, including DSP Concepts’ Audio Weaver.

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